学者信息
已发表成果：
WOK 论文 20 篇;中文核心 5 篇;其它论文 2 篇;专利发明 1 个;
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Shorting out bonding method for multi-stack anodic bonding and its application in wafer-level packaging
MODERN PHYSICS LETTERS B,0217-9849,2020-11-20.
Liu, Yifang; Dai, Tingting; Xie, Peiqin; Wang, Lingyun; Zhan, Zhan; Gu, Dandan; Xiong, Heng
WOS:000599925200011 10.1142/S0217984920503698
收录情况：SCIE -
Lithium Fluoride Coated Silicon Nanocolumns as Anodes for Lithium Ion Batteries
ACS Applied Materials and Interfaces,1944-8244,2020-04-22.
Lin, Jie; Peng, Hu; Kim, Jun-Hyuk; Wygant, Bryan R.; Meyerson, Melissa L.; Rodriguez, Rodrigo; Liu,...
WOS:000529202100025 EI:20203309037764 10.1021/acsami.9b23106
收录情况：SCIE、EI -
Investigation on Nickel-Based Nano-Scaffold Getter With Induction Heating and Rapid Activation
IEEE Transactions on Nanotechnology,1536-125X,2020.
Lin, Siying; Huang, Xiang; Gu, Dandan; Lv, Wenlong; Wang, Lingyun
WOS:000525148600002 EI:20200408089443 10.1109/TNANO.2019.2960086
收录情况：SCIE、EI