学者信息
已发表成果：
WOK 论文 66 篇;中文核心 11 篇;其它论文 4 篇;专利发明 30 个;
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Shorting out bonding method for multi-stack anodic bonding and its application in wafer-level packaging
MODERN PHYSICS LETTERS B,0217-9849,2020-11-20.
Liu, Yifang; Dai, Tingting; Xie, Peiqin; Wang, Lingyun; Zhan, Zhan; Gu, Dandan; Xiong, Heng
WOS:000599925200011 10.1142/S0217984920503698
收录情况：SCIE