学者信息
已发表成果：
WOK 论文 39 篇;中文核心 16 篇;其它论文 6 篇;专利发明 2 个;图书及章节 2 本;
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Aligning graphene nanoplates coplanar in polyvinyl alcohol by using a rotating magnetic field to fabricate thermal interface materials with high through-plane thermal conductivity
Composites Part B: Engineering,1359-8368,2023-09.
Cheng, Shujian; Guo, Xiaoxiao; Tan, Peng; Lin, Mingyuan; Cai, Jiafa; Zhou, Yinghui; Zhao, Dafang; C...
WOS:001067922300001 EI:20233314547194 10.1016/j.compositesb.2023.110916
收录情况：SCIE、EI -
A graphene aerogel with reversibly tunable thermal resistance for battery thermal management
JOURNAL OF MATERIALS CHEMISTRY A,2050-7488,2023-08-01.
Cheng, Shujian; Guo, Xiaoxiao; Tan, Peng; Yan, Bo; Lin, Mingyuan; Cai, Jiafa; Zhang, Yufeng; Cai, W...
WOS:001045048300001 EI:20233514655925 10.1039/d3ta03190j
收录情况：SCIE、EI -
Impacts of hydrogen annealing on the carrier lifetimes in p-type 4H-SiC after thermal oxidation
Chinese Physics B,1674-1056,2023-05-01.
Zhang, Ruijun; Hong, Rongdun; Han, Jingrui; Ting, Hungkit; Li, Xiguang; Cai, Jiafa; Chen, Xiaping; ...
WOS:000992220100001 EI:20232214167554 10.1088/1674-1056/ac89db
收录情况：SCIE、EI -
Tunable responsivity in high-performance SiC/graphene UV photodetectors through interfacial quantum states by bias regulation
Applied Physics Letters,0003-6951,2023-04-17.
Zhu, Baihong; Sun, Cunzhi; Chen, Jiadong; Li, Zihao; Huang, Shiming; Wu, Shaoxiong; Lin, Dingqu; Li...
WOS:000973323100004 EI:20231814029082 10.1063/5.0145334
收录情况：SCIE、EI -
Metal-Semiconductor-Metal Ultraviolet Photodetectors Based on Al Nanoparticles in 4H-SiC Microholes
ACS Applied Nano Materials,,2023.
Yuan, Meng; Zhang, Mingkun; Fu, Zhao; Han, Shan; Zhang, Yuning; Wu, Shaoxiong; Hong, Rongdun; Chen,...
WOS:001005196600001 EI:20232614308730 10.1021/acsanm.3c01080
收录情况：SCIE、EI -
High-Speed and Responsivity 4H-SiC 8 x 8 p-i-n Ultraviolet Photodiode Arrays With Micro-Hole Structure
IEEE Transactions on Electron Devices,0018-9383,2023.
Fu, Zhao; Zhang, Mingkun; Han, Shan; Cai, Jiafa; Hong, Rongdun; Chen, Xiaping; Lin, Dingqu; Wu, Sha...
WOS:001025576700001 EI:20232714340607 10.1109/TED.2023.3286379
收录情况：SCIE、EI