3D-FEM thermal transfer analysis of MEMS-based thermal infrared emitter integrated with microchannel heatsink
Infrared Physics and Technology,1350-4495,2023-05.
Huang, Zile; Wang, Weiyu; Xu, Jiaming; Zhao, Songqing; Chen, Haiyan; Chen, Binbin; Zhang, Chunquan;...
WOS:000946564400001
EI:20230813616120
10.1016/j.infrared.2023.104596
收录情况:SCIE、EI