学者信息

黄艺雄 (YiXiong Huang)

材料学院

合作者

已发表成果:

WOK 论文 23 篇;中文核心 5 篇;专利发明 32 个;

  • Thermodynamic description of the binary Al-V and ternary Al-Cr-V systems

    Calphad: Computer Coupling of Phase Diagrams and Thermochemistry,0364-5916,2023-09.
    Wang, Cuiping; Chen, Keying; Ren, Hui; Chen, Xiaodong; Huang, Yixiong; Lu, Yong; Guo, Yihui; Liu, X...
    WOS:001020427700001   EI:20232714342578   10.1016/j.calphad.2023.102579
    收录情况:SCIE、EI
  • Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Al-Ta-V Ternary System

    SSRN,1556-5068,2023-08-29.
    Lu, Yong (1, 2); Wang, Cuiping (1, 2); Zheng, Debin (1, 2); Zheng, Zhangcan (1, 2); Wu, Lianzhang (...
    EI:20230297432   10.2139/ssrn.4555625
    收录情况:EI
  • The improvement of the shape memory effect of Cu-13.5Al-4Ni high-temperature shape memory alloys through Cr-, Mo-, or V-alloying

    JOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES,2468-2284,2023-06.
    Guo, Lipeng; Chen, Feng; Chen, Shuaishuai; Huang, Yixiong; Zhang, Jinbin; Wang, Cuiping; Yang, Shui...
    WOS:001018086400001   10.1016/ajsamd.2023.100532
    收录情况:SCIE
  • Superelasticity of different-orientated Cu-Al-Ni-based austenite single crystals

    Intermetallics,0966-9795,2023-03.
    Guo, Lipeng; Chen, Xiaoqiang; Chen, Feng; Yang, Shuiyuan; Huang, Yixiong; Wang, Laisen; Wang, Cuipi...
    WOS:000919175900001   EI:20230213367371   10.1016/j.intermet.2023.107826
    收录情况:SCIE、EI
  • Reverse shape memory effect in Cu-Mn-Ga-Mo alloys

    Materials Characterization,1044-5803,2023-03.
    Zheng, Shiwei; Li, Chengyan; Guo, Lipeng; Chen, Xinren; Huang, Yixiong; Wang, Cuiping; Yang, Shuiyu...
    WOS:000923362900001   EI:20230413415518   10.1016/j.matchar.2023.112679
    收录情况:SCIE、EI
  • Experimental Investigation and Thermodynamic Description of Phase Equilibria in the Al-Cr-Mo Ternary System

    Journal of Phase Equilibria and Diffusion,1547-7037,2023.
    Wang, Cuiping; Chen, Xiaodong; Wu, Xi; Huang, Yixiong; Guo, Yihui; Yang, Shuiyuan; Lu, Yong; Liu, X...
    WOS:001129627000001   EI:20235115261502   10.1007/s11669-023-01076-6
    收录情况:SCIE、EI