学者信息

金华

航空航天学院

合作者

已发表成果:

WOK 论文 22 篇;中文核心 1 篇;其它论文 1 篇;

  • On-line identification and evolution of active and passive oxidation for SiC-based thermal protection materials in atomic oxygen environment

    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica,1000-3851,2023-08.
    Jin, Hua (1); Zhang, Shaojie (1); Li, Zhewen (2); Zhang, Jieyan (1); Mi, Zhitong (1); Xu, Chenghai ...
    EI:20233814737516   10.13801/j.cnki.fhclxb.20221018.001
    收录情况:EI
  • Phase Stabilities of Γ/Γ′ Feconialti High-Entropy Alloys Driven by Enthalpy-Entropy Competition

    SSRN,1556-5068,2023-02-19.
    Yu, Q. (1); Gu, G.C. (1); Gao, X. (1); Li, Z.N. (1); Jin, H. (1); Xu, Wei Wei (1)
    EI:20230061171   10.2139/ssrn.4363552
    收录情况:EI
  • Design and efficiency assessment of hybrid thermal protection structures for return capsule reentry

    Case Studies in Thermal Engineering,2214-157X,2023-01.
    Han, Guokai; Yang, Qiang; Yang, Fan; Xie, Weihua; Jin, Hua; Yi, Fajun; Meng, Songhe; Peng, Zujun
    WOS:000904335500006   EI:20225213293268   10.1016/j.csite.2022.102656
    收录情况:SCIE、EI
  • Formation and Evolution of Cellular Structures in Wedge-Induced Oblique Detonations

    International Journal of Aerospace Engineering,1687-5966,2023.
    Yu, Chengxuan; Luan, Zhenye; Jin, Hua; Huang, Yue; You, Yancheng
    WOS:000965261000001   EI:20231613942429   10.1155/2023/7764076
    收录情况:SCIE、EI
  • Mechanical properties and fracture behavior of ultrahigh temperature ceramics at ultrahigh temperatures

    Ceramics International,0272-8842,2023.
    Jin, Hua; Zhang, Shaojie; Hao, Yuanwen; Yang, Yinnan; Xu, Chenghai
    WOS:001047161700001   EI:20232614321719   10.1016/j.ceramint.2023.06.062
    收录情况:SCIE、EI
  • Fabrication of Al2O3 ceramic cores with high porosity and high strength by vat photopolymerization 3D printing and sacrificial templating

    Ceramics International,0272-8842,2023.
    Zhai, Xiaofei; Chen, Jingyi; Wang, Yaru; Su, Ruyue; Gao, Xiong; Zhang, Xueqin; Jin, Hua; He, Rujie
    WOS:001149131600001   EI:20233014447943   10.1016/j.ceramint.2023.07.177
    收录情况:SCIE、EI