学者信息
已发表成果：
WOK 论文 52 篇;中文核心 10 篇;其它论文 5 篇;专利发明 30 个;
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Bump height measurement of chip packaging based on white light triangulation
Guangxue Jingmi Gongcheng/Optics and Precision Engineering,1004-924X,2023-07.
Lin, Xianjin (1); Wu, Zuwei (1); Ye, Ruiqian (1); Wang, Lei (1)
EI:20233014454441 10.37188/OPE.20233113.1890
收录情况：EI
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基于机器视觉的放射治疗体位移动监测系统
光学与光电技术,1672-3392,2023-09-15.
吴祖伟;黄少胜;林贤锦;王少锋;王磊;林春