厦门大学学者库

学者信息

张淼 (Miao Zhang)

电子科学与技术学院（国家示范性微电子学院）

归档
2024
2023
2022
2021
2020
合作者

已发表成果：

WOK 论文 34 篇;其它论文 2 篇;

  • Synthesis of Thinned Planar Arrays Based on Precoded Subarray Structures

    IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS,1536-1225,2023-01.
    Zhang, Jiehuan; Mao, Xiaolian; Zhang, Miao; Hirokawa, Jiro; Liu, Qing Huo
    WOS:000966337700001   EI:20223712721578   10.1109/LAWP.2022.3201382
    收录情况：SCIE、EI

  • A Broadband Full-Corporate-Fed Slot Array Antenna Based on the Single-Layer Substrate Integrated Waveguide

    IEEE Access,2169-3536,2023.
    Duan, Baoquan; Zheng, Shijiu; Zhang, Miao; Hirokawa, Jiro; Liu, Qing Huo
    WOS:000943480400001   EI:20231013686966   10.1109/ACCESS.2023.3249963
    收录情况：SCIE、EI

  • A Wideband Full-Metal Sidewall-Loaded Magnetoelectric Dipole Array Based on Combined Ridge and Groove Gap Waveguides in the Q-Band

    IEEE Transactions on Antennas and Propagation,0018-926X,2023.
    Wu, Yaxiang; Tomura, Takashi; Hirokawa, Jiro; Zhang, Miao
    WOS:001025638200060   EI:20231714016703   10.1109/TAP.2023.3266064
    收录情况：SCIE、EI

  • A six-digit digital attenuator working in the Sub6G band

    Journal of Physics: Conference Series,1742-6588,2023.
    Liang, Peijie (1); Zhang, Miao (1); Wang, Peng (2); Li, Chengyu (1)
    EI:20233214499636   10.1088/1742-6596/2525/1/012007
    收录情况：EI

  • Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration

    IEEE Electron Device Letters,0741-3106,2023.
    Cai, Jing; Zhou, Qing; Zhang, Miao; Wu, Shu Yue; Yu, Daquan; Liu, Qing Huo
    WOS:001091151300016   EI:20233814765888   10.1109/LED.2023.3314408
    收录情况：SCIE、EI

  • A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band

    2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings,,2023.
    Cai, Jing (1); Zhang, Miao (1); Yu, Da Quan (1); Liu, Qing Huo (2)
    EI:20233814749784   10.1109/IWS58240.2023.10222257
    收录情况：EI

  • A Novel Dual Linearly-Polarized Antenna Based on Counter-Wound Quadrifilar Helix Structures

    2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings,,2023.
    Xu, Yifeng (1); Zhang, Miao (1); Dou, Yuhang (1); Wu, Ke-Li (2)
    EI:20234515021272   10.1109/ICMMT58241.2023.10276617
    收录情况：EI

  • A Novel Air-Filled Post-Wall Waveguide based on the Column Grid Array Packaging

    2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings,,2023.
    Wu, Shuyue (1); Zhou, Qing (1); Zhang, Miao (1); Yu, Da Quan (1); Huo Liu, Qing (2)
    EI:20234515020966   10.1109/ICMMT58241.2023.10277428
    收录情况：EI

  • Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer-Level Packaging

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Jing, Cai; Wu, Shuyue; Zhang, Miao; Yu, Daquan
    WOS:001221819200268   EI:20241816014511   10.1109/ICEPT59018.2023.10492214
    收录情况：EI、CPCI-S