学者信息

刘东平 (DongPing Liu)

物理科学与技术学院

合作者

已发表成果:

WOK 论文 39 篇;专利发明 3 个;图书及章节 1 本;

  • Inactivation of the tomato pathogen cladosporium fulvum by an atmospheric-pressure cold plasma jet

    Plasma Processes and Polymers,1612-8850,2014-11-01.
    Lu, Qianqian(1); Liu, Dongping(1,2); Song, Ying(1); Zhou, Renwu(2); Niu, Jinhai(1)
    WOS:000344550900004   EI:20143600034626   10.1002/ppap.201400070
    收录情况:SCIE、EI
  • Balmer-alpha and Balmer-beta Stark line intensity profiles for high-power hydrogen inductively coupled plasmas

    CHINESE PHYSICS B,1674-1056,2014-07.
    Wang Song-Bai; Lei Guang-Jiu; Liu Dong-Ping; Yang Si-Ze
    WOS:000338925300055   EI:20142817923646   10.1088/1674-1056/23/7/075201
    收录情况:SCIE、EI
  • Plasma-Assisted Chemical Vapor Deposition of Titanium Oxide Films by Dielectric Barrier Discharge in TiCl4/O-2/N-2 Gas Mixtures

    PLASMA SCIENCE & TECHNOLOGY,1009-0630,2014-07.
    Niu Jinhai; Zhang Zhihui; Fan Hongyu; Yang Qi; Liu Dongping; Qiu Jieshan
    WOS:000338718200011   EI:20142917945441   10.1088/1009-0630/16/7/11
    收录情况:SCIE、EI
  • Microscopic evolution of pre-damaged and undamaged tungsten exposed to low-energy and high-flux helium ions

    Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms,0168-583X,2014-04-15.
    Yang, Qi(1,2); Liu, Dongping(1,2,3); Fan, Hongyu(2); Li, Xin(2); Niu, Jinhai(2); Wang, Younian(1)
    WOS:000334086200011   EI:20141217474401   10.1016/j.nimb.2014.02.011
    收录情况:SCIE、EI
  • Balmer H-alpha, H-beta and H-gamma Spectral Lines Intensities in High-Power RF Hydrogen Plasmas

    PLASMA SCIENCE & TECHNOLOGY,1009-0630,2014-03.
    Wang Songbai; Lei Guangjiu; Liu Dongping; Yang Size
    WOS:000333747400007   EI:20141517552562   10.1088/1009-0630/16/3/08
    收录情况:SCIE、EI
  • Atmospheric cold plasma jet for plant disease treatment

    APPLIED PHYSICS LETTERS,0003-6951,2014-01-27.
    Zhang, Xianhui; Liu, Dongping; Zhou, Renwu; Song, Ying; Sun, Yue; Zhang, Qi; Niu, Jinhai; Fan, Hong...
    WOS:000331209900092   EI:20140717295499   10.1063/1.4863204
    收录情况:SCIE、EI