学者信息
已发表成果：
WOK 论文 36 篇;中文核心 8 篇;其它论文 3 篇;专利发明 6 个;
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Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
Precision Engineering,0141-6359,2019-01.
Wang, Ke (1); Yan, Ying (1); Zhou, Ping (1); Shi, Kang (2); Guo, Dongming (1)
WOS:000456228400008 EI:20190106333021 10.1016/j.precisioneng.2018.08.009
收录情况：SCIE、EI -
Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes
International Journal of Advanced Manufacturing Technology,0268-3768,2019.
Ou, Liwei (1); Dong, Zhigang (1); Kang, Renke (1); Shi, Kang (2); Guo, Dongming (1)
WOS:000504210700002 EI:20190406421802 10.1007/s00170-018-03279-5
收录情况：SCIE、EI -
Photoelectrochemical mechanical polishing method for n-type gallium nitride
CIRP Annals,0007-8506,2019.
Dong, Zhigang (1); Ou, Liwei (1); Kang, Renke (1); Hu, Huiqin (2); Zhang, Bi (3); Guo, Dongming (1)...
WOS:000474213500052 EI:20191806859360 10.1016/j.cirp.2019.04.121
收录情况：SCIE、EI