学者信息

Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating

Gaodeng Xuexiao Huaxue Xuebao/Chemical Journal of Chinese Universities,0251-0790,2021-09-10.
Li Weiqing; Jin Lei; Yang Jiaqiang; Wang Zhaoyun; Yang Fangzu; Zhan Dongping; Tian Zhongqun
WOS:000694009900025 EI:20213710886749 10.7503/cjcu20210225
收录情况：SCIE、EI
Research Advances in Regulating the Microenviroment of Enzyme Electrodes in Non-aqueous Systems: a Mini-review

ELECTROANALYSIS,1040-0397,2021-08.
Wang, Shizhen; Xiong, Yu; Sartin, Matthew M.; Zhan, Dongping
WOS:000683666600001 EI:20231713974228 10.1002/elan.202100300
收录情况：SCIE、EI
A Rigidity/Flexibility Compatible Strategy to Improve the Stability and Durability of Flexible Electrochemical Sensor Based on a Polydimethylsiloxane Membrane Supported Prussian Blue@Carbon Nanotube Array

ELECTROANALYSIS,1040-0397,2021-08.
Jiang, Tao; Nan, Wenjing; Han, Lianhuan; Wei, Hang; Wang, Miao; Peng, Juan; Chen, Yong; Hou, Xu; Zh...
WOS:000683607600001 EI:20231713992645 10.1002/elan.202100274
收录情况：SCIE、EI
Surface Diffusion of Underpotential-Deposited Lead Adatoms on Gold Nanoelectrodes

ChemElectroChem,2196-0216,2021-06-14.
Zhang, Baodan; Wang, Wei; Liu, Cheng; Han, Lianhuan; Peng, Juan; Oleinick, Alexander; Svir, Irina; ...
WOS:000674290100018 EI:20212910661266 10.1002/celc.202100516
收录情况：SCIE、EI
Advances of bioelectrocatalysis by oxidoreductases

Kexue Tongbao/Chinese Science Bulletin,0023-074X,2021-04-01.
Wang, Shizhen (1); Liu, Kailong (1); Zhan, Dongping (1)
EI:20211510211518 10.1360/TB-2020-1313
收录情况：EI
Pulse Potential Confined Electrochemical Polishing on Gallium Arsenide Wafer

Journal of the Electrochemical Society,0013-4651,2021-04.
Han, Lianhuan; Xu, Hantao; Sartin, Matthew M.; Hu, Zhenjiang; Zhao, Xuesen; Cao, Yongzhi; Yan, Yong...
WOS:000646827900001 EI:20212010354422 10.1149/1945-7111/abf96f
收录情况：SCIE、EI
Chemical Etching Processes at the Dynamic GaAs/Electrolyte Interface in the Electrochemical Direct-Writing Micromachining

ACS Applied Electronic Materials,,2021-01-26.
Han, Lianhuan; Wang, Yang; Sartin, Matthew M.; Zhan, Dongping; Tian, Zhong-Qun
WOS:000613935300043 EI:20210809953857 10.1021/acsaelm.0c00979
收录情况：SCIE、EI
Suppressing Sulfite Dimerization at a Polarized Gold Electrode/Water Solution Interface for High-Quality Gold Electrodeposition

Langmuir,0743-7463,2021.
Yang, Jia-Qiang; Jin, Lei; Xiao, Yuan-Hui; Yu, Huan-Huan; Yang, Fang-Zu; Zhan, Dong-Ping; Wu, De-Yi...
WOS:000703538300007 EI:20213910957178 10.1021/acs.langmuir.1c01595
收录情况：SCIE、EI
Electrochemical hydrogen-storage capacity of graphene can achieve a carbon-hydrogen atomic ratio of 1:1

Science China Chemistry,1674-7291,2021.
He, Quanfeng; Zeng, Lanping; Han, Lianhuan; Peng, Juan; Sartin, Matthew M.; Tan, Yuan-Zhi; Zhan, Do...
WOS:000710337600001 EI:20214311079764 10.1007/s11426-021-1127-1
收录情况：SCIE、EI
Electrochemical Storage of Atomic Hydrogen on Single Layer Graphene

Journal of the American Chemical Society,0002-7863,2021.
He, Quanfeng; Zeng, Lanping; Han, Lianhuan; Sartin, Matthew M.; Peng, Juan; Li, Jian-Feng; Oleinick...
WOS:000718279300010 EI:20214611145508 10.1021/jacs.1c05253
收录情况：SCIE、EI
Preparation of carbon nanotube arrays nanocomposites filled with Prussian blue and electrochemical sensing of hydrogen peroxide

Ferroelectrics,0015-0193,2021.
Jiang, Tao; Zhan, Dongping; Chen, Yong
WOS:000695478400004 EI:20213710897074 10.1080/00150193.2021.1905724
收录情况：SCIE、EI

电子电镀铜新体系中添加剂对铜电沉积及镀层结构的影响机制
高等学校化学学报,0251-0790,2021-09-09.
李威青;金磊;杨家强;王赵云;杨防祖;詹东平;田中群
CSCD核心
高密度互连印制电路板孔金属化研究和进展
电化学,1006-3471,2021-06-28.
王赵云;金磊;杨家强;李威青;詹东平;杨防祖;孙世刚
CSCD扩展
扬帆启航：电化学实验初步
电化学,1006-3471,2021-06-28.
韩联欢;何权烽;詹东平
CSCD扩展
氧化还原酶电催化反应研究进展
科学通报,0023-074X,2021-03-23.
王世珍;刘凯泷;詹东平
CSCD核心
前言:微纳尺度电化学专刊
中国科学:化学,1674-7224,2021-03-15.
詹东平
CSCD核心

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