学者信息
已发表成果：
WOK 论文 63 篇;中文核心 4 篇;专利发明 1 个;
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Thermally Activated Microstructural Evolution of PtIrCu Alloyed Nanorings: Insights from Molecular Dynamics Simulations
ACS OMEGA,2470-1343,2022-10.
Li, Tie-Jun; Yang, Wei-Hua; Pan, Jin-Yan; Huang, Rao; Shao, Gui-Fang; Wen, Yu-Hua
WOS:000873777800001 10.1021/acsomega.2c04214
收录情况：SCIE -
Morphological Transition of Vicinal 4H-SiC Surface Observed during Repeated Annealing
ACS APPLIED NANO MATERIALS,,2022-09.
Chen, Xi-Wen; Huang, Rao
WOS:000865364500001 EI:20224112866878 10.1021/acsanm.2c04108
收录情况：SCIE、EI -
Thermally activated microstructural evolution of metallic heterophase nanoparticles: insights from molecular dynamics simulations
NANOSCALE,2040-3364,2022-06.
Wen, Yu-Hua; Li, Ya-Meng; Yang, Wei-Hua; Huang, Kai-Wen; Huang, Rao
WOS:000821638500001 EI:20222912361936 10.1039/d2nr01974d
收录情况：SCIE、EI -
An Improved Self-Adaptive Differential Evolution with the Neighborhood Search Algorithm for Global Optimization of Bimetallic Clusters
JOURNAL OF CHEMICAL INFORMATION AND MODELING,1549-9596,2022-05-23.
Yang, Wei-Hua; Li, Ya-Meng; Bi, Jian-Xiang; Huang, Rao; Shao, Gui-Fang; Fan, Tian-E; Liu, Tun-Dong;...
WOS:000805762200014 EI:20222212169932 10.1021/acs.jcim.1c01570
收录情况：SCIE、EI -
Computational evaluation of ScB and TiB MBenes as promising anode materials for high-performance metal-ion batteries
PHYSICAL REVIEW MATERIALS,2475-9953,2022-04-26.
Li, Yameng; Zhao, Tao; Li, Lei; Huang, Rao; Wen, Yuhua
WOS:000795871000005 EI:20222112129784 10.1103/PhysRevMaterials.6.045801
收录情况：SCIE、EI -
Exploring Highly Efficient Dual-Metal-Site Electrocatalysts for Oxygen Reduction Reaction by First Principles Screening
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,0013-4651,2022-02-01.
Li, Lei; Li, Yameng; Zhao, Tao; Huang, Rao; Cao, Xinrui; Fan, Tiane; Wen, Yuhua
WOS:000759836300001 EI:20221011754158 10.1149/1945-7111/ac527d
收录情况：SCIE、EI -
Phase segregation in bimetallic nanodroplets
Journal of Materials Science,0022-2461,2022.
Chen, Xi-Wen; Huang, Rao; Wen, Yu-Hua
WOS:000882356700009 EI:20224613107476 10.1007/s10853-022-07884-4
收录情况：SCIE、EI