学者信息

Electrochemical Enzyme Sensor Based on the Two-Dimensional Metal-Organic Layers Supported Horseradish Peroxidase

MOLECULES,,2022-12.
Xiong, Yu; Wang, Chao; Wu, YuanFei; Luo, Chunhua; Zhan, Dongping; Wang, Shizhen
WOS:000896159600001 10.3390/molecules27238599
收录情况：SCIE
Effects of 5, 5-Dimethylhydantoin on Electroless Copper Plating

Gaodeng Xuexiao Huaxue Xuebao/Chemical Journal of Chinese Universities,0251-0790,2022-08-10.
Zheng Anni; Jin Lei; Yang Jiaqiang; Wang Zhaoyun; Li Weiqing; Yang Fangzu; Zhan Dongping; Tian Zhon...
WOS:000856799200008 EI:20223912794712 10.7503/cjcu20220191
收录情况：SCIE、EI
Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

CHEMELECTROCHEM,2196-0216,2022-06-14.
Li, Wei-Qing; Jin, Lei; Yang, Jia-Qiang; Wang, Zhao-Yun; Zhan, Dongping; Yang, Fang-Zu; Tian, Zhong...
WOS:000807119300001 EI:20222512253205 10.1002/celc.202200423
收录情况：SCIE、EI
Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

ACTA CHIMICA SINICA,0567-7351,2022-05-15.
Zheng, Annia; Jin, Lei; Yang, Jiaqiang; Li, Weiqing; Wang, Zhaoyun; Yang, Fangzu; Zhan, Dongping; T...
WOS:000804113700011 10.6023/A22010026
收录情况：SCIE
<p>Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications<br></p>

Electrochimica Acta,0013-4686,2022-04-01.
Wang, Zhao-Yun; Jin, Lei; Li, Guang; Yang, Jia-Qiang; Li, Wei-Qing; Zhan, DongPing; Jiang, Yan-Xia;...
WOS:000778862300001 EI:20220811678020 10.1016/j.electacta.2022.140018
收录情况：SCIE、EI
A Mn single atom catalyst with Mn-N2O2 sites integrated into carbon nanosheets for efficient electrocatalytic CO2 reduction

JOURNAL OF MATERIALS CHEMISTRY A,2050-7488,2022-04.
Dong, Wenfei; Zhang, Nan; Li, Sanxiu; Min, Shixiong; Peng, Juan; Liu, Wanyi; Zhan, Dongping; Bai, H...
WOS:000787365800001 EI:20222012110578 10.1039/d2ta01285e
收录情况：SCIE、EI
Large-area homogeneous corrosion process for electrochemical nanoimprint lithography on GaAs wafer by modulating contact pressure

Journal of Electroanalytical Chemistry,1572-6657,2022-03-01.
Meng, Qinghui; Han, Lianhuan; Xu, Hantao; Lin, Xiaoting; Zhang, Jie; Peng, Yunfeng; Su, Jian-Jia; Z...
WOS:000767865600008 EI:20220611606384 10.1016/j.jelechem.2022.116097
收录情况：SCIE、EI
Spatially-separated and photo-enhanced semiconductor corrosion processes for high-efficient and contamination-free electrochemical nanoimprint lithography

SCIENCE CHINA-CHEMISTRY,1674-7291,2022-03.
Xu, Hantao; Han, Lianhuan; Su, Jian-Jia; Tian, Zhong-Qun; Zhan, Dongping
WOS:000771839900001 EI:20221311845667 10.1007/s11426-021-1194-3
收录情况：SCIE、EI
Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

CHEMELECTROCHEM,2196-0216,2022-01.
Tan, Zhuo; Liu, Shuai; Wu, Jiedu; Nan, Ziang; Yang, Fangzu; Zhan, Dongping; Yan, Jiawei; Mao, Bingw...
WOS:000744676100001 EI:20220411503016 10.1002/celc.202101412
收录情况：SCIE、EI
Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application

ACS Sustainable Chemistry and Engineering,2168-0485,2022.
Jin, Lei; Li, Wei-Qing; Wang, Zhao-Yun; Yang, Jia-Qiang; Zheng, An-Ni; Yang, Fang-Zu; Zhan, Dongpin...
WOS:000877328600001 EI:20224413027679 10.1021/acssuschemeng.2c03960
收录情况：SCIE、EI

超微电极实验：基本原理、制备方法和伏安性能
电化学,1006-3471,2022-09-30.
马桢;林佳阳;南文静;韩联欢;詹东平
CSCD扩展
5,5-二甲基乙内酰脲在化学镀铜中的作用
高等学校化学学报,0251-0790,2022-08-10.
郑安妮;金磊;杨家强;王赵云;李威青;杨防祖;詹东平;田中群
CSCD核心
聚合物材料表面化学镀铜的前处理研究进展
化学学报,0567-7351,2022-05-15.
郑安妮;金磊;杨家强;李威青;王赵云;杨防祖;詹东平;田中群
CSCD核心
亚硫酸盐无氰电沉积金新工艺及机制(英文)
电化学,1006-3471,2022-03-20.
杨家强;金磊;李威青;王赵云;杨防祖;詹东平;田中群
CSCD扩展
亚硫酸盐无氰电沉积金新工艺及机制（英文）
电化学,1006-3471,2022-03-20.
杨家强;金磊;李威青;王赵云;杨防祖;詹东平;田中群
CSCD扩展

系统级封装深盲孔化学镀铜的研究
印制电路信息,1009-0096,2022-08-31.
杨彦章;张坚诚;刘彬云;詹东平;杨防祖

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