学者信息

詹东平 (DongPing Zhan)

化学化工学院

合作者

已发表成果:

WOK 论文 127 篇;中文核心 31 篇;其它论文 11 篇;专利发明 9 个;

  • Angstrom-Scale Electrochemistry at Electrodes with Dimensions Commensurable and Smaller than Individual Reacting Species

    ANGEWANDTE CHEMIE-INTERNATIONAL EDITION,1433-7851,2023-11-27.
    Zhou, Lijun; Yang, Chongyang; Yang, Xiaohui; Zhang, Jie; Wang, Cong; Wang, Wei; Li, Mengyan; Lu, Xi...
    WOS:001108862800001   EI:20234815120455   10.1002/anie.202314537
    收录情况:SCIE、EI
  • Patterning Organic Layers on Carbon Surfaces Using Electro-Labile Protected Aryl Diazonium Salts

    SSRN,1556-5068,2023-11-08.
    Taras, Max (1); Lin, Jiayang (2); Bergaminin, Jean-Francois (1); Lagrost, Corinne (1); Hapiot, Phil...
    EI:20230403282   10.2139/ssrn.4626656
    收录情况:EI
  • Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization

    Journal of Colloid and Interface Science,0021-9797,2023-10-15.
    Zheng, An-Ni; Wang, Zhao-Yun; Yang, Jia-Qiang; Jin, Lei; Yang, Fang-Zu; Zhan, Dong-Ping
    WOS:001054121500001   EI:20232414210218   10.1016/j.jcis.2023.05.177
    收录情况:SCIE、EI
  • Fabrication of silver/silver-tetracyanoquinodimethane heterogeneous nanowires using nanoskiving method

    Materials Characterization,1044-5803,2023-10.
    Fang, Zhuo; Yan, Yongda; Ma, Ji; Wang, Yang; Geng, Yanquan; Han, Lianhuan; Zhan, Dongping
    WOS:001043231400001   EI:20232914417495   10.1016/j.matchar.2023.113168
    收录情况:SCIE、EI
  • 1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating

    Journal of Industrial and Engineering Chemistry,1226-086X,2023-09-25.
    Jin, Lei; Wang, Zhao-Yun; Cai, Zhuan-Yun; Yang, Jia-Qiang; Zheng, An-Ni; Yang, Fang-Zu; Wu, De-Yin;...
    WOS:001024487900001   EI:20232514272882   10.1016/j.jiec.2023.05.036
    收录情况:SCIE、EI
  • In situ Electropolymerized 3D Microporous Cobalt-Porphyrin Nanofilm for Highly Effective Molecular Electrocatalytic Reduction of Carbon Dioxide

    ADVANCED MATERIALS,0935-9648,2023-09-21.
    Wang, Chao; Chen, Yuzhuo; Su, Daijian; Man, Wai-Lun; Lau, Kai-Chung; Han, Lianhuan; Zhao, Liubin; Z...
    WOS:001036343000001   EI:20233014449212   10.1002/adma.202303179
    收录情况:SCIE、EI
  • CMOS-compatible electrochemical nanoimprint: High throughput fabrication of ordered microstructures on semiconductor wafer by using a glassy carbon mold

    ELECTROCHIMICA ACTA,0013-4686,2023-09-10.
    Sun, Wanshi; Xu, Hantao; Han, Lianhuan; Wang, Chao; Ye, Zuoyan; Su, Jian-Jia; Wu, Yuan-Fei; Luo, Sh...
    WOS:001147717400001   EI:20232414209067   10.1016/j.electacta.2023.142700
    收录情况:SCIE、EI
  • Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection

    Colloids and Surfaces A: Physicochemical and Engineering Aspects,0927-7757,2023-08-20.
    Jin, Lei; Zheng, An-Ni; Wang, Mei; Yang, Jia-Qiang; Wang, Zhao-Yun; Yang, Fang-Zu; Wu, De -Yin; Zha...
    WOS:001015488700001   EI:20232114140733   10.1016/j.colsurfa.2023.131706
    收录情况:SCIE、EI
  • Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining

    JOURNAL OF PHYSICAL CHEMISTRY C,1932-7447,2023-07-06.
    Han, Lianhuan; Xu, Hantao; Shi, Kang; Zhou, Jian-Zhang; Yang, Fang-Zu; Zhan, Dongping; Tian, Zhong-...
    WOS:001022346900001   EI:20232914412374   10.1021/acs.jpcc.3c02985
    收录情况:SCIE、EI
  • Electrochemical Magnetorheological Finishing for Hard-to-Machine Functional Materials with Nanometer-Scaled Surface Roughness

    SSRN,1556-5068,2023-05-16.
    Liu, Jiaming (1); Han, Lianhuan (1); Lin, Xiaoting (1); Luo, Shiyi (3, 4); Peng, Yunfeng (1, 2); Zh...
    EI:20230148247   10.2139/ssrn.4450647
    收录情况:EI
  • Electrochemical regulation of the band gap of single layer graphene: from semimetal to semiconductor

    CHEMICAL SCIENCE,2041-6520,2023-05-03.
    Zeng, Lanping; Song, Weiying; Jin, Xiangfeng; He, Quanfeng; Han, Lianhuan; Wu, Yuan-fei; Lagrost, C...
    WOS:000968415000001   EI:20232014100885   10.1039/d2sc06800a
    收录情况:SCIE、EI
  • A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening

    Journal of Electroanalytical Chemistry,1572-6657,2023-05-01.
    Wang, Zhao-Yun; Jin, Lei; Yang, Jia-Qiang; Li, Wei-Qing; Wu, De-Yin; Zhan, DongPing; Yang, Fang-Zu;...
    WOS:000964947300001   EI:20231413855107   10.1016/j.jelechem.2023.117373
    收录情况:SCIE、EI
  • Fabrication of Ag/Ag-Tcnq Heterogeneous Nanowires Using Nanoskiving Method

    SSRN,1556-5068,2023-03-06.
    Fang, Zhuo (1, 2); Yan, Yongda (1, 2); Ma, Ji (2); Wang, Yang (3); Geng, Yanquan (1, 2); Han, Lianh...
    EI:20230078203   10.2139/ssrn.4379244
    收录情况:EI
  • Dynamically Interfacial pH-Buffering Effect Enabled by <i>N</i>-Methylimidazole Molecules as Spontaneous Proton Pumps toward Highly Reversible Zinc-Metal Anodes

    ADVANCED MATERIALS,0935-9648,2023-03.
    Zhang, Minghao; Hua, Haiming; Dai, Pengpeng; He, Zheng; Han, Lianhuan; Tang, Peiwen; Yang, Jin; Lin...
    WOS:000943192600001   EI:20231013693133   10.1002/adma.202208630
    收录情况:SCIE、EI
  • Micromachining of predesigned perpendicular copper micropillar array by scanning electrochemical microscopy

    Electrochimica Acta,0013-4686,2023-02-20.
    Han, Lianhuan; Ma, Zhen; Wang, Chao; Ye, Zuoyan; Su, Jian-Jia; Luo, ShiYi; Wu, Yuan-Fei; Zhan, Dong...
    WOS:000922204300001   EI:20230413427661   10.1016/j.electacta.2023.141913
    收录情况:SCIE、EI
  • Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)(4)(-) coordination ions

    Electrochimica Acta,0013-4686,2023-01-01.
    Jin, Lei; Liang, Zhi-Hao; Yang, Jia-Qiang; Zheng, An-Ni; Wang, Zhao-Yun; Yang, Fang-Zu; Wu, De-Yin;...
    WOS:000911127800001   EI:20224513072477   10.1016/j.electacta.2022.141494
    收录情况:SCIE、EI
  • Ultrasonic-Assisted Electrochemical Nanoimprint Lithography: Forcing Mass Transfer to Enhance the Localized Etching Rate of GaAs

    Chemistry - An Asian Journal,1861-4728,2023.
    Liu, Bing; Han, Lianhuan; Xu, Hantao; Su, Jian-Jia; Zhan, Dongping
    WOS:001043803600001   EI:20233214518391   10.1002/asia.202300491
    收录情况:SCIE、EI
  • Regulation of heterogeneous electron transfer reactivity by defect engineering through electrochemically induced brominating addition

    Chemical Science,2041-6520,2023.
    Zeng, Lanping; Han, Lianhuan; Nan, Wenjing; Song, Weiying; Luo, Shiyi; Wu, Yuan-Fei; Su, Jian-Jia; ...
    WOS:001105707700001   EI:20234815109449   10.1039/d3sc03920j
    收录情况:SCIE、EI
  • 面向集成电路产业的电子电镀研究方法

    中国科学:化学,1674-7224,2023-08-16.
    金磊;杨家强;赵弈;王赵云;陈思余;郑安妮;宋韬;杨防祖;詹东平
    CSCD核心库
  • 单层石墨烯微米尺度图案化和功能化:调控电子传输特性(英文)

    电化学,1006-3471,2023-10-07.
    崔苗苗;韩联欢;曾兰平;郭佳瑶;宋维英;刘川;吴元菲;罗世翊;刘云华;詹东平
  • 铅酸蓄电池正极板栅腐蚀与防护研究进展

    电源技术,1002-087X,2023-08-20.
    欧阳裕;韩联欢;熊建文;石杰;詹东平
  • 电极/碱性聚电解质界面的微分电容曲线和零电荷电位测定(英文)

    电化学,1006-3471,2023-06-15.
    刘晨希;邹泽萍;胡梅雪;丁宇;谷宇;刘帅;南文静;马溢昌;陈招斌;詹东平;张秋根;庄林;颜佳伟;毛秉伟