学者信息
已发表成果：
WOK 论文 35 篇;中文核心 2 篇;其它论文 3 篇;专利发明 2 个;
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Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
Journal of Alloys and Compounds,0925-8388,2020-12-10.
He, Huang; Huang, Shangyu; Ye, Yongchao; Xiao, Yong; Zhang, Zhihao; Li, Mingyu; Goodall, Russell
WOS:000566452300001 EI:20202908938337 10.1016/j.jallcom.2020.156240
收录情况：SCIE、EI -
Rapid manufacturing of complete intermetallic joints using Cu/Sn foam composite by ultrasonic- assisted soldering
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
Zhu, Yichen (1); Wei, Cunwei (1); Li, Liyun (1); Cao, Huijun (2); Zhang, Zhihao (1)
EI:20204309396674 10.1109/ICEPT50128.2020.9202530
收录情况：EI -
Synthesis of bimodal silver nanoparticles for inkjet-printed flexible electronics with excellent stretchability
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
Wei, Cunwei (1); Xu, Xinling (1); Zhou, Qi (1); Cao, Huijun (1); Zhang, Zhihao (1)
EI:20204309396886 10.1109/ICEPT50128.2020.9202995
收录情况：EI -
Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil
Materials Science and Engineering A,0921-5093,2020-07-22.
Xiao, Yong (1, 2); Song, Zhipeng (1); Li, Shan (1); Li, Dan (1); Zhang, Zhihao (3); Li, Mingyu (4);...
EI:20202608861130 10.1016/j.msea.2020.139691
收录情况：EI -
Growth evolution and formation mechanism of eta '-Cu6Sn5 whiskers on eta-Cu6Sn5 intermetallics during room-temperature ageing
Acta Materialia,1359-6454,2020-01-15.
Zhang, Z. H.; Wei, C. W.; Han, J. J.; Cao, H. J.; Chen, H. T.; Li, M. Y.
WOS:000506465100029 EI:20194707725658 10.1016/j.actamat.2019.11.032
收录情况：SCIE、EI -
Fabrication of high-fracture-strength and gas-tightness PDC films via PIP process for pressure sensor application
JOURNAL OF THE AMERICAN CERAMIC SOCIETY,0002-7820,2020.
Yu, Yuxi; Liu, Yixin; Zhang, Zhihao; Zhang, Jibin
WOS:000516632600001 EI:20201008257522 10.1111/jace.17063
收录情况：SCIE、EI