学者信息

NiFeCo alloy nanoparticles composited with phosphorus-doped vacancies-abundant carbon substrates as electrocatalyst for oxygen evolution reaction

Journal of Alloys and Compounds,0925-8388,2024-09-15.
Qian, Hai; Long, Zihao; Huang, Shuqin; Zhang, Zhihao; Li, Jintang
WOS:001249229700001 EI:20242316191496 10.1016/j.jallcom.2024.175050
收录情况：SCIE、EI

Current Status of Electronic Packaging Materials Using Machine Learning

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,0577-6686,2023-11.
Zhang, Shuye (1, 2); Duan, Xiaokang (1); Luo, Keyu (1); Xu, Sunwu (1); Zhang, Zhihao (3); Chen, Jie...
EI:20240915644705 10.3901/JME.2023.22.222
收录情况：EI

Significant enhancement of comprehensive properties of SnBi solder through the addition of Cu@Ag core-shell particles

Materials Science and Engineering: A,0921-5093,2023-08-10.
Li, S. Q.; Li, Q. H.; Cao, H. J.; Zheng, X. Z.; Zhang, Z. H.
WOS:001058222400001 EI:20232814379382 10.1016/j.msea.2023.145392
收录情况：SCIE、EI

Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

Journal of Materials Research and Technology,2238-7854,2023-05-01.
Wang, Chengqian; Luo, Keyu; He, Peng; Zhou, Hongzhi; Li, Rongqing; Zhang, Zhihao; Yu, Daquan; Zhang...
WOS:000964618700001 EI:20231413844478 10.1016/j.jmrt.2023.03.102
收录情况：SCIE、EI

Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles

Microelectronics International,1356-5362,2023.
Li, Liyun; Zhang, Yu; Xia, Shiyu; Sun, Zhefei; Yuan, Junjie; Su, Dongchuan; Cao, Hunjun; Chai, Xiao...
WOS:000911766600001 EI:20230313398940 10.1108/MI-11-2022-0186
收录情况：SCIE、EI

Facet Dopant Regulation of Cu2O Boosts Electrocatalytic CO2 Reduction to Formate

Advanced Functional Materials,1616-301X,2023.
Ma, Xintao; Zhang, Yinggan; Fan, Tingting; Wei, Diye; Huang, Zongyi; Zhang, Zhihao; Zhang, Zheng; D...
WOS:000918402700001 EI:20230513455312 10.1002/adfm.202213145
收录情况：SCIE、EI

Brittle and ductile behavior in monolayer MoS2

Materials Today Nano,2588-8420,2022-12.
Liu, J.; Sestak, P.; Zhang, Z.; Wu, J.
WOS:000848625600007 EI:20223312578258 10.1016/j.mtnano.2022.100245
收录情况：SCIE、EI

Microstructural characteristics and material removal mechanisms in nano-scale finished surface of mirror-like injection mould fabricated by laser metal deposition and post treatments

Applied Surface Science,0169-4332,2022-11-15.
Wang, Zhiguo; Zhao, Jibin; Zhao, Yuhui; Zhang, Zhihao; He, Zhenfeng; He, Chen
WOS:000848287800003 EI:20223012410042 10.1016/j.apsusc.2022.154263
收录情况：SCIE、EI

Surface Passivation of Cu Nanofiber Films Fabricated by Electrospinning for Transparent Conductive Films

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
Sun, Zhefei (1); Wang, Ming-Sheng (1); Zhang, Zhihao (1)
EI:20214511119725 10.1109/ICEPT52650.2021.9567937
收录情况：EI

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Journal of Alloys and Compounds,0925-8388,2020-12-10.
He, Huang; Huang, Shangyu; Ye, Yongchao; Xiao, Yong; Zhang, Zhihao; Li, Mingyu; Goodall, Russell
WOS:000566452300001 EI:20202908938337 10.1016/j.jallcom.2020.156240
收录情况：SCIE、EI

Rapid manufacturing of complete intermetallic joints using Cu/Sn foam composite by ultrasonic- assisted soldering

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
Zhu, Yichen (1); Wei, Cunwei (1); Li, Liyun (1); Cao, Huijun (2); Zhang, Zhihao (1)
EI:20204309396674 10.1109/ICEPT50128.2020.9202530
收录情况：EI

Synthesis of bimodal silver nanoparticles for inkjet-printed flexible electronics with excellent stretchability

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
Wei, Cunwei (1); Xu, Xinling (1); Zhou, Qi (1); Cao, Huijun (1); Zhang, Zhihao (1)
EI:20204309396886 10.1109/ICEPT50128.2020.9202995
收录情况：EI

Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

Materials Science and Engineering A,0921-5093,2020-07-22.
Xiao, Yong (1, 2); Song, Zhipeng (1); Li, Shan (1); Li, Dan (1); Zhang, Zhihao (3); Li, Mingyu (4);...
EI:20202608861130 10.1016/j.msea.2020.139691
收录情况：EI

Growth evolution and formation mechanism of eta '-Cu6Sn5 whiskers on eta-Cu6Sn5 intermetallics during room-temperature ageing

Acta Materialia,1359-6454,2020-01-15.
Zhang, Z. H.; Wei, C. W.; Han, J. J.; Cao, H. J.; Chen, H. T.; Li, M. Y.
WOS:000506465100029 EI:20194707725658 10.1016/j.actamat.2019.11.032
收录情况：SCIE、EI

Fabrication of high-fracture-strength and gas-tightness PDC films via PIP process for pressure sensor application

JOURNAL OF THE AMERICAN CERAMIC SOCIETY,0002-7820,2020.
Yu, Yuxi; Liu, Yixin; Zhang, Zhihao; Zhang, Jibin
WOS:000516632600001 EI:20201008257522 10.1111/jace.17063
收录情况：SCIE、EI

Damage Mechanism of Cu6Sn5 Intermetallics Due to Cyclic Polymorphic Transitions

MATERIALS,,2019-12-02.
Zhang, ZH; Wei, CW; Cao, HJ; Zhang, Y
WOS:000507308200105 EI:20200808207773 10.3390/ma12244127
收录情况：SCIE、EI

Damage mechanism of cu6sn5 intermetallics due to cyclic polymorphic transitions

Materials,,2019-12-01.
Zhang, Zhihao (1, 2); Wei, Cunwei (1, 2); Cao, Huijun (3); Zhang, Ye (1)
EI:20200608138199 10.3390/ma1224127
收录情况：EI

Structure-induced metastable phase transformation in Cu6Sn5 intermetallics

Materials Letters,0167-577X,2019-08-15.
Zhang, Z.H. (1, 2); Wei, C.W. (1, 2); Cao, H.J. (3); Han, J.J. (2); Zhang, Y. (1)
WOS:000467535500032 EI:20191706818471 10.1016/j.matlet.2019.04.083
收录情况：SCIE、EI

Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

SCIENTIFIC REPORTS,2045-2322,2018-11-27.
Hang, CJ; He, JJ; Zhang, ZH; Chen, HT; Li, MY
WOS:000451315600009 10.1038/s41598-018-35708-6
收录情况：SCIE

Study of the Fast Sintering of Silver Nanoparticle Ink Induced by Sodium chloride solution at Room Temperature

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,,2018-10-02.
Xiao, Yong (1); Zhang, Zhihao (2); Yang, Ming (3); Yang, Haifeng (1); Li, Mingyu (1); Cao, Yong (1)
EI:20184606075833 10.1109/ICEPT.2018.8480763
收录情况：EI

Fast room-temperature sintering of Ag nanoparticles on polyethylene terephthalate film

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,,2018-10-02.
Zhang, Zhihao (1, 3); Wei, Cunwei (1); Han, Jiajia (1); Cao, Huijun (2); Zhang, Yinggan (1); Yu, Yu...
EI:20184606076111 10.1109/ICEPT.2018.8480466
收录情况：EI

Research on Evolution Behaviors of SnPb Solder under High Current Stressing

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018,,2018-10-02.
Cao, Huijun (1); Zhang, Zhihao (2, 3); Yu, Yuxi (2, 3)
EI:20184606075894 10.1109/ICEPT.2018.8480550
收录情况：EI

The effect of NaOH on room-temperature sintering of Ag nanoparticles for high-performance flexible electronic application

Materials Letters,0167-577X,2018-07-01.
Xiao, Y.(1); Zhang, Z.H.(2,4); Yang, M.(3); Yang, H.F.(1); Li, M.Y.(1); Cao, Y.(1)
WOS:000429899800005 EI:20181404973452 10.1016/j.matlet.2018.03.164
收录情况：SCIE、EI

Formation mechanism of a cathodic serrated interface and voids under high current density

Materials Letters,0167-577X,2018-01-15.
Zhang, Z.H.(1,2); Cao, H.J.(3); Chen, H.T.(4)
WOS:000414340900050 EI:20174104256393 10.1016/j.matlet.2017.09.111
收录情况：SCIE、EI

Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test

Microelectronics Reliability,0026-2714,2018-01.
Guo, Qiang(1); Sun, Siyu(1); Zhang, Zhihao(2); Chen, Hongtao(1); Li, Mingyu(1)
WOS:000423891400018 EI:20175204575804 10.1016/j.microrel.2017.12.001
收录情况：SCIE、EI

Low-temperature sintering of bimodal Ag nanoparticles for power electronics applications

18th International Conference on Electronic Packaging Technology, ICEPT 2017,,2017-09-19.
Xiao, Yong(1); Cao, Yong(1); Zhang, Zhihao(2); Yang, Ming(3); Wang, Shuai(4); Li, Mingyu(1)
EI:20174504376139 10.1109/ICEPT.2017.8046511
收录情况：EI

Formation mechanism and reliability of Cu6Sn5textures formed in-between liquid Sn and (111)/(001) Cu single crystals

18th International Conference on Electronic Packaging Technology, ICEPT 2017,,2017-09-19.
Yao, Shun(1); Wang, Xuelin(2); Yang, Shihua(2); Zhang, Zhihao(1); Cao, Huijun(3)
EI:20174504376368 10.1109/ICEPT.2017.8046490
收录情况：EI

Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density

Journal of Electronic Materials,0361-5235,2017-04-14.
Zhang, Zhihao(1); Cao, Huijun(2); Yang, Haifeng(3); Xiao, Yong(3); Li, Mingyu(3); Yu, Yuxi(1); Yao,...
WOS:000404530900042 EI:20171603575627 10.1007/s11664-017-5511-z
收录情况：SCIE、EI

Electromigration-induced growth mode transition of anodic Cu6Sn5grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects

Journal of Alloys and Compounds,0925-8388,2017.
Zhang, Zhihao(1); Cao, Huijun(2); Xiao, Yong(3); Cao, Yong(3); Li, Mingyu(3); Yu, Yuxi(1)
WOS:000397634000001 EI:20170503312283 10.1016/j.jallcom.2017.01.292
收录情况：SCIE、EI

Inkjet-printed Ag tracks sintered at room-Temperature on flexible substrate

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016,,2016-10-04.
Zhang, Zhihao(1); Jin, Xin(1); Cao, Huijun(2)
EI:20164502990827 10.1109/ICEPT.2016.7583132
收录情况：EI

Inherent growth habit of Cu6Sn5phase at the liquid Sn0.7wt%Cu solder/ (111)Cujoint interface

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016,,2016-10-04.
Cao, Huijun(1); Zhang, Zhihao(2)
EI:20164502990847 10.1109/ICEPT.2016.7583152
收录情况：EI

Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5Phase in Liquid Sn-Based Solder

Journal of Electronic Materials,0361-5235,2016-08-08.
Zhang, Z.H.(1); Cao, H.J.(2); Yang, H.F.(3); Li, M.Y.(3); Yu, Y.X.(1)
WOS:000385021300060 EI:20163302706915 10.1007/s11664-016-4814-9
收录情况：SCIE、EI

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

SCIENTIFIC REPORTS,2045-2322,2016-06-08.
Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.
WOS:000377475300001 10.1038/srep27522
收录情况：SCIE

Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)(Cu) and (001)(Cu) surfaces using electron backscattered diffraction

MATERIALS & DESIGN,0261-3069,2016-03-15.
Zhang, Zhihao; Cao, Huijun; Li, Mingyu; Yu, Yuxi; Yang, Haifeng; Yang, Shihua
WOS:000369589200032 10.1016/j.matdes.2016.01.037
收录情况：SCIE

Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces

ACTA MATERIALIA,1359-6454,2016-02-01.
Zhang, Z. H.; Li, M. Y.; Liu, Z. Q.; Yang, S. H.
WOS:000369677800001 10.1016/j.actamat.2015.11.034
收录情况：SCIE

首页

学者

机构