学者信息

马盛林 (ShengLin Ma)

萨本栋微米纳米科学技术研究院

合作者

已发表成果:

WOK 论文 80 篇;中文核心 6 篇;其它论文 5 篇;专利发明 7 个;

  • Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device

    MICROSYSTEMS & NANOENGINEERING,2055-7434,2022-11-11.
    Lian, Tingting; Xia, Yanming; Wang, Zhizheng; Yang, Xiaofeng; Fu, Zhiwei; Kong, Xin; Lin, Shuxun; M...
    WOS:000881611800001   EI:20224613114520   10.1038/s41378-022-00462-3
    收录情况:SCIE、EI
  • An addressable electrowetting valve for centrifugal microfluidics

    Sensors and Actuators B: Chemical,0925-4005,2022-10-15.
    Xia, Yanming; Song, Chao; Meng, Yingchao; Xue, Peng; deMello, Andrew J.; Gao, Quan; Stavrakis, Stav...
    WOS:000829242300001   EI:20222812352263   10.1016/j.snb.2022.132276
    收录情况:SCIE、EI
  • Inductively coupled plasma etching of bulk tungsten for MEMS applications

    Sensors and Actuators A: Physical,0924-4247,2022-10-01.
    Xia, Yanming; Wang, Zetian; Song, Lu; Wang, Wei; Chen, Jing; Ma, Shenglin
    WOS:000848761300007   EI:20223412612636   10.1016/j.sna.2022.113825
    收录情况:SCIE、EI
  • A Glass-Ultra-Thin PDMS Film-Glass Microfluidic Device for Digital PCR Application Based on Flexible Mold Peel-Off Process

    MICROMACHINES,,2022-10.
    Xia, Yanming; Chu, Xianglong; Zhao, Caiming; Wang, Nanxin; Yu, Juan; Jin, Yufeng; Sun, Lijun; Ma, S...
    WOS:000873275200001   EI:20224413036828   10.3390/mi13101667
    收录情况:SCIE、EI
  • Finger-inspired rigid-soft hybrid tactile sensor with superior sensitivity at high frequency

    NATURE COMMUNICATIONS,,2022-08-29.
    Zhang, Jinhui; Yao, Haimin; Mo, Jiaying; Chen, Songyue; Xie, Yu; Ma, Shenglin; Chen, Rui; Luo, Tao;...
    WOS:000847533800027   10.1038/s41467-022-32827-7
    收录情况:SCIE
  • Inductively Coupled Plasma Etching of Bulk Tungsten for Mems Applications

    SSRN,1556-5068,2022-06-25.
    Xia, Yanming (1); Wang, Zetian (2); Song, Lu (2); Wang, Wei (2); Chen, Jing (3); Ma, Shenglin (1)
    EI:20220212075  
    收录情况:EI
  • In flow-based technologies: A new paradigm for the synthesis and processing of covalent-organic frameworks

    Chemical Engineering Journal,1385-8947,2022-05-01.
    Martinez-Bulit, Pablo; Sorrenti, Alessandro; Miguel, David Rodriguez San; Mattera, Michele; Belce, ...
    WOS:000773586800001   EI:20220711630609   10.1016/j.cej.2022.135117
    收录情况:SCIE、EI
  • A Wideband High-Efficiency GaN MMIC Power Amplifier for Sub-6-GHz Applications

    Micromachines,,2022-05.
    Hu, Liulin; Liao, Xuejie; Zhang, Fan; Wu, Haifeng; Ma, Shenglin; Lin, Qian; Tang, Xiaohong
    WOS:000804332200001   EI:20222212180406   10.3390/mi13050793
    收录情况:SCIE、EI
  • A Strategy for Extracting Full Material Coefficients of AlN Thin Film Based on Resonance Method

    Micromachines,,2022-04.
    Wang, Chen; Yang, Yang; Qin, Lifeng; Ma, Shenglin; Jin, Yufeng
    WOS:000786367900001   EI:20221611980389   10.3390/mi13040513
    收录情况:SCIE、EI
  • Multi-compartment supracapsules made from nano-containers towards programmable release

    MATERIALS HORIZONS,2051-6347,2022-04.
    Hu, Minghan; Reichholf, Nico; Xia, Yanming; Alvarez, Laura; Cao, Xiaobao; Ma, Shenglin; DeMello, An...
    WOS:000786641300001   EI:20222012118090   10.1039/d2mh00135g
    收录情况:SCIE、EI
  • TSV-based common-mode noise-suppressing filter design and implementation

    ELECTRONICS LETTERS,0013-5194,2022-02.
    Li, Zhensong; Liu, Huan; Sun, Yunheng; Yang, Yang; Miao, Min; Ma, Shenglin; Jin, Yufeng
    WOS:000749551300001   EI:20220711627363   10.1049/ell2.12412
    收录情况:SCIE、EI
  • A Differentially Fed Dual-polarized Antenna-in-Package Based on Stacked TGV Interposers for 5G Application

    2022 International Conference on Electronics Packaging, ICEP 2022,,2022.
    Zhang, Gengtao (1); Chen, Haojie (1); Yang, Yang (1); Ma, Shenglin (2); Jin, Yufeng (1)
    EI:20222712321192   10.23919/ICEP55381.2022.9795370
    收录情况:EI
  • Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-Area High-performance SOC Chip

    InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM,1936-3958,2022.
    Lian, Tingting (1); Wang, Zhizheng (1); Yuan, Hai (2); Jin, Yufeng (3); Wang, Wei (4); Ma, Shenglin...
    EI:20224413028476   10.1109/iTherm54085.2022.9899524
    收录情况:EI
  • A WEARABLE MICROFLUIDIC PATCH FOR REAL-TIME COLLECTING, STORAGE, AND COLORIMETRIC ANALYSIS OF SWEAT

    MicroTAS 2022 - 26th International Conference on Miniaturized Systems for Chemistry and Life Sciences,,2022.
    Yu, Juan (1); Wang, Zhizhen (1); Xia, Yanming (1); Chu, Xianglong (1); Zhao, Caiming (1); Wang, Nan...
    EI:20234515027142  
    收录情况:EI
  • A GLASS-ULTRA-THIN PDMS FILM-GLASS MICROFLUIDIC DEVICE FOR DIGITAL PCR APPLICATION BASED FLEXIBLE MOLD PEEL-OFF PROCESS

    MicroTAS 2022 - 26th International Conference on Miniaturized Systems for Chemistry and Life Sciences,,2022.
    Xia, Yanming (1, 2); Chu, Xianglong (1); Zhao, Caiming (1); Wang, Nanxin (1, 3); Yu, Juan (1); Jin,...
    EI:20234515027161  
    收录情况:EI
  • AN ADDRESSABLE ELECTROWETTING VALVE FOR CENTRIFUGAL MICROFLUIDICS

    MicroTAS 2022 - 26th International Conference on Miniaturized Systems for Chemistry and Life Sciences,,2022.
    Xia, Yanming (1, 2); Song, Chao (2); Meng, Yingchao (2); Xue, Peng (2); deMello, Andrew J. (2); Gao...
    EI:20234515027121  
    收录情况:EI
  • CONTROLLABLE HIGH-SPEED MIXING MICROFLUIDICS DEVICE BASED ON AN AZ-SU8 PHOTORESISTS COMBINATIONAL MOLD PROCESS

    MicroTAS 2022 - 26th International Conference on Miniaturized Systems for Chemistry and Life Sciences,,2022.
    Wang, Nanxin (1, 2); Chu, Xianglong (2); Restrepo, Ramón Santiago Herrera (4); Xia, Yanming (2, 3);...
    EI:20234515027412  
    收录情况:EI
  • 基于TSV转接板的三维集成热-力学建模与仿真分析

    导航与控制,1674-5558,2022-08-05.
    张桐铨;吴晓东;马盛林