Design, Fabrication, Characterization, and Simulation of AlN-Based Piezoelectric Micromachined Ultrasonic Transducer for Sonar Imaging Applications

An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning

An inter-scale simulation method for TSV 3D IC based on linear superposition algorithm and TSV model sharing strategy

Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems"

Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device

An addressable electrowetting valve for centrifugal microfluidics

Inductively coupled plasma etching of bulk tungsten for MEMS applications

A Glass-Ultra-Thin PDMS Film-Glass Microfluidic Device for Digital PCR Application Based on Flexible Mold Peel-Off Process

Finger-inspired rigid-soft hybrid tactile sensor with superior sensitivity at high frequency

Inductively Coupled Plasma Etching of Bulk Tungsten for Mems Applications

In flow-based technologies: A new paradigm for the synthesis and processing of covalent-organic frameworks

A Wideband High-Efficiency GaN MMIC Power Amplifier for Sub-6-GHz Applications

A Strategy for Extracting Full Material Coefficients of AlN Thin Film Based on Resonance Method

Multi-compartment supracapsules made from nano-containers towards programmable release

TSV-based common-mode noise-suppressing filter design and implementation

A Differentially Fed Dual-polarized Antenna-in-Package Based on Stacked TGV Interposers for 5G Application

Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-Area High-performance SOC Chip

A WEARABLE MICROFLUIDIC PATCH FOR REAL-TIME COLLECTING, STORAGE, AND COLORIMETRIC ANALYSIS OF SWEAT

A GLASS-ULTRA-THIN PDMS FILM-GLASS MICROFLUIDIC DEVICE FOR DIGITAL PCR APPLICATION BASED FLEXIBLE MOLD PEEL-OFF PROCESS

AN ADDRESSABLE ELECTROWETTING VALVE FOR CENTRIFUGAL MICROFLUIDICS

CONTROLLABLE HIGH-SPEED MIXING MICROFLUIDICS DEVICE BASED ON AN AZ-SU8 PHOTORESISTS COMBINATIONAL MOLD PROCESS

An alN-based piezoelectric micromachined ultrasonic transducer with a double-beam suspended structure

Simulation and Optimization of 3D Heterogeneous Integration of Inertial Micro-System

A Novel Ultrasonic TOF Ranging System Using AlN Based PMUTs

A RF Redundant TSV Interconnection for High Resistance Si Interposer

Vertically-Oriented Ti3C2Tx MXene Membranes for High Performance of Electrokinetic Energy Conversion

Design, Fabrication and Measurement of Micro-Bumps Array for RF Application

Design and Experimentally Verification of a Vertical Coaxial Transmission Structure in High resistivity Si Interposer

Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

Thermal resistance analysis for a high power 3D integrated RF Module based on TSV interposer

Design, Fabrication and Test of Dual Redundant TSV Interconnection for Millimeter Wave Applications

Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter

Study on AlN micromachined ultrasonic transducer array with beamforming

Thermal Property Evaluation of TSV interposer Embedded Microfluidics for Cooling 2.5D Integrated High Power IC Device

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

A 2.5D integrated L band Receiver based on High resistivity Si interposer

Study of the properties of AlN PMUT used as a wireless power receiver

Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure

Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics

Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array

Design and Process Technology for High Q Integrated Inductor on Interposer with TSV

High Aspect Ratio TGV Fabrication Using Photosensitive Glass Substrate

A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

Batch-Mode μuSM Process for Surrounding Air Cavity and TCV Holes of AlN Ceramic Substrate Application for Patch Antenna

Si interposer with multiple cavities for 3D stacked fan-out package

Fabrication and characterization of AlN based Piezoelectric Micromachined Ultrasonic Transducer for contact sensing

Fabrication and characterization of a low parasitic capacitance and low-stress Si interposer for 2.5D integration

Design, fabrication and characterization of TSV interposer integrated 3D capacitor for SIP applications

Thermal and electrical characterization of TSV interposer embedded with microchannel for 2.5D Integration of GaN RF Devices

Design, fabrication and characterization of a novel TSV interposer integrated inductor for RF applications

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Fabrication of polymer microneedle array based on tungsten mold and optimized replication method

Fabrication and Characterization of Annular Copper Through-silicon Via for Passive Interposer Applications

Effect of annealing process on the properties of through-silicon-via electroplating copper

Fabrication of the micromachined poly-dimethylsiloxane pyramidal tips arrays for biotechnology packaging applications

Effect of Metallic Materials Films on the Properties of Copper/Tin Micro-Bump Thermo-Compression Bonding

Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Interposer fabrication with annular copper TSV and multi-layered redistribution layer

A Novel Ropes-Driven Wideband Piezoelectric Vibration Energy Harvester

Process development of thick Si interposer for 2.5D integration of RF MEMS devices

Process development of through-glass-via (TGV) interposer for radio frequency (RF) applications

Process development of a new TGV interposer for wafer level package of inertial MEMS device

Parametric study of DRIE process for enhancing the profile-preserving property of square through silicon via

Design and characterization of petaloid hollow Cu interconnection for interposer

Fabrication and filling quality optimization of the high density and small size through silicon via array for three-dimensional packaging

Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer

Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology

Fabrication and Characterization of Low Stress Si Interposer with Air-Gapped Si Interconnection for Hermetical System-in-Package

Process Development and Characterization for Integrating Microchannel into TSV Interposer

Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias

Effect of Induced Current on the Flow Stress in the Electromagnetic Ring Expansion

Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process

Study on the Estimation Algorithm of the Temperature Based on Mid-Wave Infrared Remote Sensing

Electrode effects on mass sensitivity of GaN thin film bulk acoustic wave resonator sensors

Analysis of frequency characteristics of MEMS piezoelectric cantilever beam based energy harvester

Mechanical and electrical reliability assessment of bump-less wafer-on-wafer integration with one-time bottom-up TSV filling

Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives

Laser micro-milling of microchannel on copper sheet as catalyst support used in microreactor for hydrogen production

Electrical characterization of integrated passive devices using thin film technology for 3D integration

Development and characterization of a through-multilayer TSV integrated SRAM module