学者信息
已发表成果：
WOK 论文 17 篇;其它论文 3 篇;
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Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
SENSORS,,2022-03.
Chen, Zuohuan; Yu, Daquan; Zhong, Yi
WOS:000774299800001 10.3390/s22062114
收录情况：SCIE -
Stress Issues in 3D Interconnect Technology Using Through Glass Vias
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,0577-6686,2022-01-20.
Zhao, Jin (1); Li, Wei (2); Zhong, Yi (2); Yu, Daquan (2); Qin, Fei (1)
EI:20221611993409 10.3901/JME.2022.02.246
收录情况：EI -
Study on the cracking mechanism of Au Bump during temperature-humidity test
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
Liu, Zhongliang (1); Zhong, Yi (1); Chen, Scott (2); Miao, Xiaoyong (3)
EI:20224012840801 10.1109/ICEPT56209.2022.9873258
收录情况：EI -
Study on Warpage of Interposer by Chip Distribution
2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022,,2022.
He, Yimin (1); Lu, Xiangjun (1); Bao, Shuchao (2); Zhong, Yi (2); Zhang, Mingchuan (3); Xue, Kai (3...
EI:20230613547440 10.1109/ICICM56102.2022.10011298
收录情况：EI