Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces

Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Quasi-2D Phonon Transport in Diamond Nanosheet

Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces

Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers

On the optimization of molding warpage for wafer-level glass interposer packaging

Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging

Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Stress Issues in 3D Interconnect Technology Using Through Glass Vias

Study on the cracking mechanism of Au Bump during temperature-humidity test

Study on Warpage of Interposer by Chip Distribution