已发表成果:
WOK 论文 35 篇;中文核心 2 篇;其它论文 3 篇;专利发明 2 个;
Current Status of Electronic Packaging Materials Using Machine Learning
Significant enhancement of comprehensive properties of SnBi solder through the addition of Cu@Ag core-shell particles
Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles
Facet Dopant Regulation of Cu2O Boosts Electrocatalytic CO2 Reduction to Formate
基于机器学习电子封装互连材料研究现状
机械工程学报,0577-6686,2023-11-20.