学者信息
已发表成果：
WOK 论文 17 篇;其它论文 3 篇;
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Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces
SSRN,1556-5068,2023-11-16.
Zhou, Shangtong (1); Jiang, Xiaofan (1); Zhong, Yi (1); Yu, Daquan (1); Cheng, Qijin (1)
EI:20230416661 10.2139/ssrn.4635143
收录情况：EI -
Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers
SSRN,1556-5068,2023-11-08.
Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
EI:20230403026 10.2139/ssrn.4627642
收录情况：EI -
Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers
SSRN,1556-5068,2023-10-06.
Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
EI:20230355768 10.2139/ssrn.4593961
收录情况：EI -
On the optimization of molding warpage for wafer-level glass interposer packaging
Journal of Materials Science: Materials in Electronics,0957-4522,2023-04.
Bao, Shuchao; Li, Wei; He, Yimin; Zhong, Yi; Zhang, Long; Yu, Daquan
WOS:000980451400003 EI:20231914058008 10.1007/s10854-023-10475-x
收录情况：SCIE、EI -
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
IEEE Electron Device Letters,0741-3106,2023.
Hu, Zhihui; Zhou, Qing; Ma, Haozhe; Wang, Manyu; Zhong, Yi; Dou, Yuhang; Yu, Daquan
WOS:001108431800037 EI:20232914408110 10.1109/LED.2023.3295596
收录情况：SCIE、EI -
Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Jiang, Xiaofan; Tao, Zeming; Yu, Tian; Jiang, Binbin; Zhong, Yi; Yu, Daquan
WOS:001221819200122 EI:20241816014865 10.1109/ICEPT59018.2023.10492042
收录情况：EI、CPCI-S
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芯片三维互连技术及异质集成研究进展
电子与封装,1681-1070,2023-03-20.
钟毅;江小帆;喻甜;李威;于大全