学者信息
已发表成果：
WOK 论文 17 篇;其它论文 3 篇;
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Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers
Journal of Materials Science and Technology,1005-0302,2024-07-20.
Zhong, Yi; Bao, Shuchao; He, Ran; Jiang, Xiaofan; Zhang, Hengbo; Ruan, Wenbiao; Zhang, Mingchuan; Y...
WOS:001177919500001 EI:20240515462708 10.1016/j.jmst.2023.11.043
收录情况：SCIE、EI -
Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces
SURFACES AND INTERFACES,2468-0230,2024-03.
Zhou, Shangtong; Jiang, Xiaofan; Zhong, Yi; Yu, Daquan; Cheng, Qijin
WOS:001186852900001 10.1016/j.surfin.2024.103973
收录情况：SCIE -
Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers
SURFACES AND INTERFACES,2468-0230,2024-03.
Jiang, Xiaofan; Tao, Zeming; Li, Yuan; Sun, Fangyuan; Yu, Daquan; Zhong, Yi
WOS:001186976700001 10.1016/j.surfin.2024.103985
收录情况：SCIE -
Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells
SMALL,1613-6810,2024-02-17.
Tu, Silong; Gang, Yong; Lin, Yuanqiong; Liu, Xinyue; Zhong, Yi; Yu, Daquan; Li, Xin
WOS:001163757900001 EI:20240815571644 10.1002/smll.202310868
收录情况：SCIE、EI -
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging
Sensors,1424-8220,2024-01.
Yu, Chen; Wu, Shaocheng; Zhong, Yi; Xu, Rongbin; Yu, Tian; Zhao, Jin; Yu, Daquan
WOS:001140335500001 EI:20240215373722 10.3390/s24010171
收录情况：SCIE、EI -
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
IEEE Electron Device Letters,0741-3106,2024.
Zhong, Yi; Bao, Shuchao; He, Yimin; He, Ran; Jiang, Xiaofan; Zhang, Hengbo; Zhao, Yuchun; Wang, Yan...
WOS:001178151900021 EI:20240315389560 10.1109/LED.2024.3351990
收录情况：SCIE、EI -
Quasi-2D Phonon Transport in Diamond Nanosheet
Advanced Functional Materials,1616-301X,2024.
Zhu, Yunting (1); Ye, Tian (1); Wen, Hailang (1); Xu, Rongbin (1); Zhong, Yi (1); Lin, Guangyang (1...
EI:20243016764925 10.1002/adfm.202407333
收录情况：EI
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集成电路互连微纳米尺度硅通孔技术进展
电子与封装,1681-1070,2024-06-20.
黎科;张鑫硕;夏启飞;钟毅;于大全