学者信息
已发表成果：
WOK 论文 92 篇;中文核心 39 篇;其它论文 28 篇;专利发明 8 个;
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Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating
Gaodeng Xuexiao Huaxue Xuebao/Chemical Journal of Chinese Universities,0251-0790,2021-09-10.
Li Weiqing; Jin Lei; Yang Jiaqiang; Wang Zhaoyun; Yang Fangzu; Zhan Dongping; Tian Zhongqun
WOS:000694009900025 EI:20213710886749 10.7503/cjcu20210225
收录情况：SCIE、EI -
Electro-reduction of Cr(III) ions under the effects of complexing agents and Fe(II) ions
JOURNAL OF ELECTROANALYTICAL CHEMISTRY,1572-6657,2021-02-01.
Liu, Cheng; Jin, Lei; Yang, Jia-Qiang; Yang, Fang-Zu; Tian, Zhong-Qun
WOS:000626266500009 10.1016/j.jelechem.2021.114987
收录情况：SCIE -
Suppressing Sulfite Dimerization at a Polarized Gold Electrode/Water Solution Interface for High-Quality Gold Electrodeposition
Langmuir,0743-7463,2021.
Yang, Jia-Qiang; Jin, Lei; Xiao, Yuan-Hui; Yu, Huan-Huan; Yang, Fang-Zu; Zhan, Dong-Ping; Wu, De-Yi...
WOS:000703538300007 EI:20213910957178 10.1021/acs.langmuir.1c01595
收录情况：SCIE、EI
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电子电镀铜新体系中添加剂对铜电沉积及镀层结构的影响机制
高等学校化学学报,0251-0790,2021-09-09.
李威青;金磊;杨家强;王赵云;杨防祖;詹东平;田中群
CSCD核心 -
高密度互连印制电路板孔金属化研究和进展
电化学,1006-3471,2021-06-28.
王赵云;金磊;杨家强;李威青;詹东平;杨防祖;孙世刚
CSCD扩展