厦门大学学者库

学者信息

于大全

电子科学与技术学院（国家示范性微电子学院）

归档
2025
2024
2023
2022
2021
合作者

已发表成果：

WOK 论文 79 篇;中文核心 2 篇;其它论文 8 篇;

  • Double-sided Electroplating Process for through Glass Vias (TGVs) Filling

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Li, Ke (1); Wu, Heng (2); Chen, Weijian (2); Yu, Daquan (1)
    EI:20214511119893   10.1109/ICEPT52650.2021.9568055
    收录情况：EI

  • Warpage Characteristic of Glass Interposer with Different CTE's and Thickness

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Zhao, Jin (1); Qin, Fei (1); Yu, Daquan (2); Chen, Zuohuan (2); Zhao, Shuai (1)
    EI:20214511119679   10.1109/ICEPT52650.2021.9568041
    收录情况：EI

  • The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Su, Yangquan (1); Ren, Kuili (2); Huang, Yiyong (2); Zhang, Mingchuan (2); Yu, Daquan (1, 2)
    EI:20214511119567   10.1109/ICEPT52650.2021.9568223
    收录情况：EI

  • Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Zhong, Yi (1, 2); Bao, Shuchao (1, 2); Li, Ke (1, 2); Zhang, Mingchuan (2); Yu, Daquan (1, 2)
    EI:20214511119642   10.1109/ICEPT52650.2021.9568004
    收录情况：EI

  • Characteristics of 10-110GHz Transmission Lines on Fused Silica Substrate for Millimeter-wave Modules

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Yu, Tian (1); Xue, Kai (2); Li, Ke (1); Liang, Yihang (1); Yu, Daquan (1)
    EI:20214511119646   10.1109/ICEPT52650.2021.9568008
    收录情况：EI

  • 3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with through Glass Vias

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Chen, Zuohuan (1); Zhao, Jin (2); Jiang, Feng (3); Wu, Heng (3); Zhang, Mingchuan (4); Yu, Daquan (...
    EI:20214511119722   10.1109/ICEPT52650.2021.9567934
    收录情况：EI

  • Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Liu, Wen (1); Li, Jinhui (1); Liu, Jinshan (1); Wang, Tao (1); Zhong, Ao (1); Zhang, Guoping (1); L...
    EI:20214511119895   10.1109/ICEPT52650.2021.9568057
    收录情况：EI

  • Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2021-07.
    Chen, Zuohuan; Yu, Daquan; Zhang, Mingchuan; Jiang, Feng
    WOS:000675202100006   EI:20213010691359   10.1109/TCPMT.2021.3091998
    收录情况：SCIE、EI

  • Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

    Colloids and Surfaces A: Physicochemical and Engineering Aspects,0927-7757,2021-05-05.
    Huang, Dongxu; Huang, Mingqi; Sun, Deliang; Liu, Bincan; Xuan, Rui; Liu, Jinshan; Sun, Rong; Li, Ji...
    WOS:000635435400005   EI:20210909997371   10.1016/j.colsurfa.2021.126339
    收录情况：SCIE、EI

  • A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm(2) Power Density

    Digest of Technical Papers - IEEE International Solid-State Circuits Conference,0193-6530,2021-02-13.
    Pan, Dongfang; Li, Guolong; Miao, Fangting; Deng, Biao; Wei, Junying; Yu, Daquan; Liu, Ming; Cheng,...
    WOS:000662193600189   EI:20211110082235   10.1109/ISSCC42613.2021.9365955
    收录情况：EI、CPCI-S

  • Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,0957-4522,2021.
    Chen, Li; Yu, Daquan
    WOS:000655580100003   EI:20212210435913   10.1007/s10854-021-06205-w
    收录情况：SCIE、EI

  • Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies

    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND;PROCESSING SYSTEMS,0946-7076,2021.
    Wang, Chengqian; Zhang, Meng; Ming, Xuefei; Ma, Shuying; Yu, Daquan
    WOS:000668054700001   EI:20212710589499   10.1007/s00542-021-05228-x
    收录情况：SCIE、EI

  • The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

    IEEE Electron Device Letters,0741-3106,2021.
    Lu, Yao; Yu, Daquan; Wan, Lixi; Zhang, Xiaodong; Xiang, Min; Zhang, Zhiqiang; Su, Min; Qiu, Weibao
    WOS:000690440900034   EI:20213210750863   10.1109/LED.2021.3100064
    收录情况：SCIE、EI

  • 玻璃通孔技术研究进展

    电子与封装,1681-1070,2021-04-20.
    陈力;杨晓锋;于大全

  • 声表面波滤波器圆片级互连封装技术研究

    中国集成电路,1681-5289,2021-03-05.
    陈作桓;于大全;张名川