学者信息

于大全

电子科学与技术学院(国家示范性微电子学院)

合作者

已发表成果:

WOK 论文 79 篇;中文核心 2 篇;其它论文 8 篇;

  • Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

    Journal of Materials Science and Technology,1005-0302,2024-07-20.
    Zhong, Yi; Bao, Shuchao; He, Ran; Jiang, Xiaofan; Zhang, Hengbo; Ruan, Wenbiao; Zhang, Mingchuan; Y...
    WOS:001177919500001   EI:20240515462708   10.1016/j.jmst.2023.11.043
    收录情况:SCIE、EI
  • Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application

    Journal of Manufacturing Processes,1526-6125,2024-07-15.
    Wang, Zhao-Yun; Yu, Daquan; Jin, Lei; Yang, Jia-Qiang; Zhan, Dongping; Zu Yang, Fang-; Sun, Shi-Gang
    WOS:001247344100001   EI:20242216161061   10.1016/j.jmapro.2024.05.041
    收录情况:SCIE、EI
  • Optical Amplification at 1.5 μm in Er<SUP>III</SUP> Coordination Polymer-Doped Waveguides Based on Intramolecular Energy Transfer

    ADVANCED SCIENCE,,2024-06-19.
    Shi, Xiaowu; Man, Yi; He, Yan; Xu, Hui; Zhang, Baoping; Yu, Daquan; Lin, Zhuliang; Lv, Ziyue; Zhao,...
    WOS:001250769100001   EI:20242516285866   10.1002/advs.202401131
    收录情况:SCIE、EI
  • Demonstration of Optical Gain at 1535 nm Based on Er<SUP>III</SUP> Complex-Doped Polymer Waveguides Under Light-Emitting Diode Excitation

    ADVANCED OPTICAL MATERIALS,2195-1071,2024-06-05.
    He, Yan; Man, Yi; Shi, Xiaowu; Xu, Hui; Lin, Zhuliang; Zhang, Baoping; Yu, Daquan; Huang, Yuyang; Z...
    WOS:001239443300001   EI:20242316213705   10.1002/adom.202400496
    收录情况:SCIE、EI
  • Terahertz sensing with a 3D meta-absorbing chip based on two-photon polymerization printing

    Photonics Research,2327-9125,2024-05.
    Chen, Xueer; Ye, Longfang; Yu, Daquan
    WOS:001240409800003   EI:20241916066071   10.1364/PRJ.519652
    收录情况:SCIE、EI
  • Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

    VACUUM,0042-207X,2024-03.
    Wang, Manyu; Wang, Jiahui; Jin, Lei; Yu, Tian; Yu, Daquan
    WOS:001147115400001   10.1016/j.vacuum.2023.112927
    收录情况:SCIE
  • Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces

    SURFACES AND INTERFACES,2468-0230,2024-03.
    Zhou, Shangtong; Jiang, Xiaofan; Zhong, Yi; Yu, Daquan; Cheng, Qijin
    WOS:001186852900001   10.1016/j.surfin.2024.103973
    收录情况:SCIE
  • Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

    SURFACES AND INTERFACES,2468-0230,2024-03.
    Jiang, Xiaofan; Tao, Zeming; Li, Yuan; Sun, Fangyuan; Yu, Daquan; Zhong, Yi
    WOS:001186976700001   10.1016/j.surfin.2024.103985
    收录情况:SCIE
  • Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells

    SMALL,1613-6810,2024-02-17.
    Tu, Silong; Gang, Yong; Lin, Yuanqiong; Liu, Xinyue; Zhong, Yi; Yu, Daquan; Li, Xin
    WOS:001163757900001   EI:20240815571644   10.1002/smll.202310868
    收录情况:SCIE、EI
  • Influence of growth parameters and systematical analysis on 8-inch piezoelectric AlN thin films by magnetron sputtering

    Materials Science in Semiconductor Processing,1369-8001,2024-01.
    Wu, Shaocheng; Xu, Rongbin; Guo, Bingliang; Ma, Yinggong; Yu, Daquan
    WOS:001164961600001   EI:20234214925749   10.1016/j.mssp.2023.107895
    收录情况:SCIE、EI
  • Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

    Sensors,1424-8220,2024-01.
    Yu, Chen; Wu, Shaocheng; Zhong, Yi; Xu, Rongbin; Yu, Tian; Zhao, Jin; Yu, Daquan
    WOS:001140335500001   EI:20240215373722   10.3390/s24010171
    收录情况:SCIE、EI
  • Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

    IEEE Electron Device Letters,0741-3106,2024.
    Zhong, Yi; Bao, Shuchao; He, Yimin; He, Ran; Jiang, Xiaofan; Zhang, Hengbo; Zhao, Yuchun; Wang, Yan...
    WOS:001178151900021   EI:20240315389560   10.1109/LED.2024.3351990
    收录情况:SCIE、EI
  • Development of CGA-PWW Devices Based on Advanced Wafer-Level Processing Technology

    IEEE Electron Device Letters,0741-3106,2024.
    Zhou, Qing; Wu, Shuyue; Zhou, Yaqing; Ruan, Wenbiao; Wei, Changning; Zhang, Miao; Yu, Daquan
    WOS:001194155100039   EI:20240715545738   10.1109/LED.2024.3362901
    收录情况:SCIE、EI
  • Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection

    IEEE Sensors Journal,1530-437X,2024.
    Chen, Xueer; Ye, Longfang; Yu, Daquan
    WOS:001245623500098   EI:20241115717278   10.1109/JSEN.2024.3367890
    收录情况:SCIE、EI
  • Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2024.
    Zhao, Jin; Qin, Fei; Yu, Daquan
    WOS:001314320500014   EI:20242316203122   10.1109/TCPMT.2024.3406905
    收录情况:SCIE、EI
  • Metal Penetration and Grain Boundary in MoS<sub>2</sub> Memristors

    Advanced Electronic Materials,2199-160X,2024.
    Yan, Han; Zhuang, Pingping; Li, Bo; Ye, Tian; Zhou, Changjie; Chen, Yushan; Li, Tiejun; Cai, Weiwei...
    WOS:001238958900001   EI:20242316213821   10.1002/aelm.202400264
    收录情况:SCIE、EI
  • Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging

    2024 IEEE International Workshop on Antenna Technology, iWAT 2024,,2024.
    Jing, Cai; Zhang, Miao; Yu, Daquan; Hirokawa, Jiro
    WOS:001234915500095   EI:20242416238371   10.1109/iWAT57102.2024.10535871
    收录情况:EI、CPCI-S
  • Quasi-2D Phonon Transport in Diamond Nanosheet

    Advanced Functional Materials,1616-301X,2024.
    Zhu, Yunting (1); Ye, Tian (1); Wen, Hailang (1); Xu, Rongbin (1); Zhong, Yi (1); Lin, Guangyang (1...
    EI:20243016764925   10.1002/adfm.202407333
    收录情况:EI
  • Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis

    APPLIED PHYSICS LETTERS,0003-6951,2023-11-20.
    Li, Bo; Ye, Tian; Yan, Han; Zhu, Yunting; Bao, Lingjie; Li, Mingpo; Cheng, Qijin; Zhuang, Pingping;...
    WOS:001106651900005   EI:20234815131887   10.1063/5.0175474
    收录情况:SCIE、EI
  • Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces

    SSRN,1556-5068,2023-11-16.
    Zhou, Shangtong (1); Jiang, Xiaofan (1); Zhong, Yi (1); Yu, Daquan (1); Cheng, Qijin (1)
    EI:20230416661   10.2139/ssrn.4635143
    收录情况:EI
  • Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

    SSRN,1556-5068,2023-11-08.
    Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
    EI:20230403026   10.2139/ssrn.4627642
    收录情况:EI
  • Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers

    SSRN,1556-5068,2023-10-06.
    Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
    EI:20230355768   10.2139/ssrn.4593961
    收录情况:EI
  • Development of high performance 2.5D packaging using glass interposer with through glass vias

    Journal of Materials Science: Materials in Electronics,0957-4522,2023-09.
    Zhao, Jin; Chen, Zuohuan; Qin, Fei; Yu, Daquan
    WOS:001064918900004   EI:20233714717337   10.1007/s10854-023-11185-0
    收录情况:SCIE、EI
  • Influence of Growth Parameters and Systematical Analysis on 8-Inch Piezoelectric Aln Thin Films by Magnetron Sputtering

    SSRN,1556-5068,2023-08-21.
    Wu, Shaocheng (1); Xu, Rongbin (1); Guo, Bingliang (2); Ma, Yinggong (2); Yu, Daquan (1)
    EI:20230284988   10.2139/ssrn.4546667
    收录情况:EI
  • Large-area multilayer molybdenum disulfide for 2D memristors

    Materials Today Nano,2588-8420,2023-08.
    Zhuang, Pingping; Yan, Han; Li, Bo; Dou, Chao; Ye, Tian; Zhou, Changjie; Zhu, Huili; Tian, Bo; Chen...
    WOS:001049935800001   EI:20232214170221   10.1016/j.mtnano.2023.100353
    收录情况:SCIE、EI
  • Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

    Journal of Materials Research and Technology,2238-7854,2023-05-01.
    Wang, Chengqian; Luo, Keyu; He, Peng; Zhou, Hongzhi; Li, Rongqing; Zhang, Zhihao; Yu, Daquan; Zhang...
    WOS:000964618700001   EI:20231413844478   10.1016/j.jmrt.2023.03.102
    收录情况:SCIE、EI
  • Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

    ELECTRONICS,,2023-04-30.
    Li, Wei; Yu, Daquan
    WOS:000987311700001   10.3390/electronics12092073
    收录情况:SCIE
  • On the optimization of molding warpage for wafer-level glass interposer packaging

    Journal of Materials Science: Materials in Electronics,0957-4522,2023-04.
    Bao, Shuchao; Li, Wei; He, Yimin; Zhong, Yi; Zhang, Long; Yu, Daquan
    WOS:000980451400003   EI:20231914058008   10.1007/s10854-023-10475-x
    收录情况:SCIE、EI
  • Electrical performance characterization of glass substrate for millimeter-wave applications

    Journal of Materials Science: Materials in Electronics,0957-4522,2023-01.
    Yu, Tian; Yu, Daquan
    WOS:000913653300002   EI:20230313400320   10.1007/s10854-022-09583-x
    收录情况:SCIE、EI
  • High-Gain of Nd<SUP>III</SUP> Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 μm Wavelengths Based on Intramolecular Energy Transfer Mechanism

    Advanced Materials,0935-9648,2023.
    Lin, Zhuliang; Man, Yi; Lv, Ziyue; Zhang, Baoping; Xu, Hui; Yu, Daquan; Yang, Xingchen; He, Yan; Sh...
    WOS:000928593000001   EI:20230613564241   10.1002/adma.202209239
    收录情况:SCIE、EI
  • A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology

    IEEE Electron Device Letters,0741-3106,2023.
    Ma, Haozhe; Hu, Zhihui; Yu, Daquan
    WOS:001021302800047   EI:20232114132452   10.1109/LED.2023.3275197
    收录情况:SCIE、EI
  • Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging

    IEEE Electron Device Letters,0741-3106,2023.
    Hu, Zhihui; Zhou, Qing; Ma, Haozhe; Wang, Manyu; Zhong, Yi; Dou, Yuhang; Yu, Daquan
    WOS:001108431800037   EI:20232914408110   10.1109/LED.2023.3295596
    收录情况:SCIE、EI
  • Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration

    IEEE Electron Device Letters,0741-3106,2023.
    Cai, Jing; Zhou, Qing; Zhang, Miao; Wu, Shu Yue; Yu, Daquan; Liu, Qing Huo
    WOS:001091151300016   EI:20233814765888   10.1109/LED.2023.3314408
    收录情况:SCIE、EI
  • A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band

    2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings,,2023.
    Cai, Jing (1); Zhang, Miao (1); Yu, Da Quan (1); Liu, Qing Huo (2)
    EI:20233814749784   10.1109/IWS58240.2023.10222257
    收录情况:EI
  • A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2023.
    Yu, Tian; Li, Weiwen; Yu, Daquan
    WOS:001098139000019   EI:20234014841758   10.1109/TCPMT.2023.3318232
    收录情况:SCIE、EI
  • A Novel Air-Filled Post-Wall Waveguide based on the Column Grid Array Packaging

    2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings,,2023.
    Wu, Shuyue (1); Zhou, Qing (1); Zhang, Miao (1); Yu, Da Quan (1); Huo Liu, Qing (2)
    EI:20234515020966   10.1109/ICMMT58241.2023.10277428
    收录情况:EI
  • Electrical properties of AlGaN/GaN HEMT under different temperatures

    Proceedings of SPIE - The International Society for Optical Engineering,0277-786X,2023.
    Liang, Yihang (1); Yu, Tian (1); Yu, Daquan (1)
    EI:20234815108265   10.1117/12.3010802
    收录情况:EI
  • Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Wang, Manyu; Li, Ke; Bao, Shuchao; Liu, Zhongliang; Zhu, Yunting; Wang, Jiahui; Xia, Qifei; Wu, Sha...
    WOS:001221819200137   EI:20241816014880   10.1109/ICEPT59018.2023.10492061
    收录情况:EI、CPCI-S
  • Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Jiang, Xiaofan; Tao, Zeming; Yu, Tian; Jiang, Binbin; Zhong, Yi; Yu, Daquan
    WOS:001221819200122   EI:20241816014865   10.1109/ICEPT59018.2023.10492042
    收录情况:EI、CPCI-S
  • Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer-Level Packaging

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Jing, Cai; Wu, Shuyue; Zhang, Miao; Yu, Daquan
    WOS:001221819200268   EI:20241816014511   10.1109/ICEPT59018.2023.10492214
    收录情况:EI、CPCI-S
  • On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Yu, Tian; Chen, Xin; Zhou, Yaqing; Liu, Zhongliang; Hu, Yuwen; Yu, Daquan
    WOS:001221819200100   EI:20241816014593   10.1109/ICEPT59018.2023.10492015
    收录情况:EI、CPCI-S
  • TGV filling process based on low temperature conductive silver paste

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Yu, Chen; Li, Wei; Yang, Tingting; Wu, Heng; Yu, Daquan
    WOS:001221819200235   EI:20241816014628   10.1109/ICEPT59018.2023.10492174
    收录情况:EI、CPCI-S
  • Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

    2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
    Zhao, Jin; Qin, Fei; Chen, Zuohuan; Yu, Daquan
    WOS:001221819200383   EI:20241816014676   10.1109/ICEPT59018.2023.10492334
    收录情况:EI、CPCI-S
  • Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

    MICROMACHINES,,2022-10.
    Zhao, Jin; Chen, Zuohuan; Qin, Fei; Yu, Daquan
    WOS:000873274700001   EI:20224413036256   10.3390/mi13101799
    收录情况:SCIE、EI
  • Development of a Reliable High-Performance WLP for a SAW Device

    SENSORS,,2022-08.
    Chen, Zuohuan; Yu, Daquan
    WOS:000839746500001   10.3390/s22155760
    收录情况:SCIE
  • Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

    SENSORS,,2022-03.
    Chen, Zuohuan; Yu, Daquan; Zhong, Yi
    WOS:000774299800001   10.3390/s22062114
    收录情况:SCIE
  • Stress Issues in 3D Interconnect Technology Using Through Glass Vias

    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,0577-6686,2022-01-20.
    Zhao, Jin (1); Li, Wei (2); Zhong, Yi (2); Yu, Daquan (2); Qin, Fei (1)
    EI:20221611993409   10.3901/JME.2022.02.246
    收录情况:EI
  • Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

    IEEE Electron Device Letters,0741-3106,2022.
    Su, Yangquan; Yu, Daquan; Ruan, Wenbiao; Jia, Ning
    WOS:000800191500029   EI:20221712037991   10.1109/LED.2022.3168877
    收录情况:SCIE、EI
  • Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2022.
    Li, Wei; Yu, Daquan
    WOS:000800180000021   EI:20221611993986   10.1109/TCPMT.2022.3165638
    收录情况:SCIE、EI
  • Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate

    2022 China Semiconductor Technology International Conference, CSTIC 2022,,2022.
    Ma, Haozhe (1, 2); Hu, Zhihui (1, 2); Zhou, Qing (1, 2); Chen, Jiabin (1); Yu, Daquan (1, 2)
    EI:20223712740216   10.1109/CSTIC55103.2022.9856753
    收录情况:EI
  • Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

    2022 China Semiconductor Technology International Conference, CSTIC 2022,,2022.
    Bao, Shuchao (1, 2); Zhang, Yi (1, 2); He, Yimin (2, 3); Li, Ke (1, 2); Yu, Daquan (1, 2)
    EI:20223712739976   10.1109/CSTIC55103.2022.9856914
    收录情况:EI
  • Enhancement of inductance and quality factor of solenoid inductor by Integrating Printing magnetic film On glass wafer

    2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
    Hu, Zhihui (1); Ma, Haozhe (1); Zhou, Qing (1); Bao, Shuchao (1); Yu, Daquan (2)
    EI:20224012840723   10.1109/ICEPT56209.2022.9873440
    收录情况:EI
  • Reliability Study of WLP for IPD with Through Glass Vias Vertical Interconnection

    2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
    Zhao, Jin (1, 2); Qin, Fei (1); Yu, Daquan (3); Chen, Zuohuan (2)
    EI:20224012840877   10.1109/ICEPT56209.2022.9873383
    收录情况:EI
  • Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

    2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
    Li, Wei (1); Yu, Daquan (1, 2)
    EI:20224012840451   10.1109/ICEPT56209.2022.9873208
    收录情况:EI
  • Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology

    2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
    Chen, Zuohuan (1); Zhao, Jin (2); Zhang, Jiqin (3); Zhang, Long (3); Yu, Daquan (1)
    EI:20224012840450   10.1109/ICEPT56209.2022.9873207
    收录情况:EI
  • Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2022.
    Chen, Zuohuan; Yu, Daquan; Jiang, Feng
    WOS:000761210100023   EI:20220311480736   10.1109/TCPMT.2022.3140863
    收录情况:SCIE、EI
  • Double-sided Electroplating Process for through Glass Vias (TGVs) Filling

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Li, Ke (1); Wu, Heng (2); Chen, Weijian (2); Yu, Daquan (1)
    EI:20214511119893   10.1109/ICEPT52650.2021.9568055
    收录情况:EI
  • Warpage Characteristic of Glass Interposer with Different CTE's and Thickness

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Zhao, Jin (1); Qin, Fei (1); Yu, Daquan (2); Chen, Zuohuan (2); Zhao, Shuai (1)
    EI:20214511119679   10.1109/ICEPT52650.2021.9568041
    收录情况:EI
  • The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Su, Yangquan (1); Ren, Kuili (2); Huang, Yiyong (2); Zhang, Mingchuan (2); Yu, Daquan (1, 2)
    EI:20214511119567   10.1109/ICEPT52650.2021.9568223
    收录情况:EI
  • Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Zhong, Yi (1, 2); Bao, Shuchao (1, 2); Li, Ke (1, 2); Zhang, Mingchuan (2); Yu, Daquan (1, 2)
    EI:20214511119642   10.1109/ICEPT52650.2021.9568004
    收录情况:EI
  • Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Liu, Wen (1); Li, Jinhui (1); Liu, Jinshan (1); Wang, Tao (1); Zhong, Ao (1); Zhang, Guoping (1); L...
    EI:20214511119895   10.1109/ICEPT52650.2021.9568057
    收录情况:EI
  • Characteristics of 10-110GHz Transmission Lines on Fused Silica Substrate for Millimeter-wave Modules

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Yu, Tian (1); Xue, Kai (2); Li, Ke (1); Liang, Yihang (1); Yu, Daquan (1)
    EI:20214511119646   10.1109/ICEPT52650.2021.9568008
    收录情况:EI
  • 3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with through Glass Vias

    2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021,,2021-09-14.
    Chen, Zuohuan (1); Zhao, Jin (2); Jiang, Feng (3); Wu, Heng (3); Zhang, Mingchuan (4); Yu, Daquan (...
    EI:20214511119722   10.1109/ICEPT52650.2021.9567934
    收录情况:EI
  • Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping

    IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2021-07.
    Chen, Zuohuan; Yu, Daquan; Zhang, Mingchuan; Jiang, Feng
    WOS:000675202100006   EI:20213010691359   10.1109/TCPMT.2021.3091998
    收录情况:SCIE、EI
  • Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

    Colloids and Surfaces A: Physicochemical and Engineering Aspects,0927-7757,2021-05-05.
    Huang, Dongxu; Huang, Mingqi; Sun, Deliang; Liu, Bincan; Xuan, Rui; Liu, Jinshan; Sun, Rong; Li, Ji...
    WOS:000635435400005   EI:20210909997371   10.1016/j.colsurfa.2021.126339
    收录情况:SCIE、EI
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    Digest of Technical Papers - IEEE International Solid-State Circuits Conference,0193-6530,2021-02-13.
    Pan, Dongfang; Li, Guolong; Miao, Fangting; Deng, Biao; Wei, Junying; Yu, Daquan; Liu, Ming; Cheng,...
    WOS:000662193600189   EI:20211110082235   10.1109/ISSCC42613.2021.9365955
    收录情况:EI、CPCI-S
  • Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,0957-4522,2021.
    Chen, Li; Yu, Daquan
    WOS:000655580100003   EI:20212210435913   10.1007/s10854-021-06205-w
    收录情况:SCIE、EI
  • Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies

    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND;PROCESSING SYSTEMS,0946-7076,2021.
    Wang, Chengqian; Zhang, Meng; Ming, Xuefei; Ma, Shuying; Yu, Daquan
    WOS:000668054700001   EI:20212710589499   10.1007/s00542-021-05228-x
    收录情况:SCIE、EI
  • The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

    IEEE Electron Device Letters,0741-3106,2021.
    Lu, Yao; Yu, Daquan; Wan, Lixi; Zhang, Xiaodong; Xiang, Min; Zhang, Zhiqiang; Su, Min; Qiu, Weibao
    WOS:000690440900034   EI:20213210750863   10.1109/LED.2021.3100064
    收录情况:SCIE、EI
  • Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate

    Proceedings of 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020,,2020-11-23.
    Xiaoli, Ren (1); Junying, Wei (1); Daquan, Yu (2)
    EI:20210709927956   10.1109/ICTA50426.2020.9332031
    收录情况:EI
  • Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

    Sensors (Switzerland),1424-8220,2020-08-01.
    Zhou, Tianshen; Ma, Shuying; Yu, Daquan; Li, Ming; Hang, Tao
    WOS:000559251000001   EI:20203008973613   10.3390/s20154077
    收录情况:SCIE、EI
  • Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

    2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
    Chen, Zuohuan (1); Zhang, Mingchuan (2); Zhu, Kai (2); Jiang, Feng (2); Yu, Daquan (1)
    EI:20204309396532   10.1109/ICEPT50128.2020.9202920
    收录情况:EI
  • Synergistic Effect of Additives on Filling of Tapered TGV Vias by Copper Electroplating

    2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020,,2020-08.
    Wu, Shanshan (1); Ling, Huiqin (1); Xie, Yitong (1); Li, Ming (1); Yu, Daquan (2)
    EI:20204309396896   10.1109/ICEPT50128.2020.9202635
    收录情况:EI
  • A promising embedded silicon fan-out wafer level package with laser releasable temporary bonding technology

    China Semiconductor Technology International Conference 2020, CSTIC 2020,,2020-06-26.
    Wang, Chengqian (1, 2); Zhang, Aibing (1); Li, Zhengfeng (1); Li, Shouwei (1); Li, Yang (1); Ji, Yo...
    EI:20210309773847   10.1109/CSTIC49141.2020.9282470
    收录情况:EI
  • Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

    Proceedings - Electronic Components and Technology Conference,0569-5503,2020-06.
    Yu, Tian; Zhang, Xiaodong; Chen, Li; Ren, Xiaoli; Duan, Zongming; Yu, Daquan
    WOS:000620983200006   EI:20203709155959   10.1109/ECTC32862.2020.00018
    收录情况:EI、CPCI-S
  • Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2156-3950,2020-04.
    Qin, Fei; Zhao, Shuai; Dai, Yanwei; Yang, Mengke; Xiang, Min; Yu, Daquan
    WOS:000524260600022   10.1109/TCPMT.2020.2975571
    收录情况:SCIE
  • Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

    Journal of Materials Science: Materials in Electronics,0957-4522,2020.
    Du, Yahong; Gao, Li-Yin; Yu, Daquan; Liu, Zhi-Quan
    WOS:000514597300023   EI:20200207995694   10.1007/s10854-019-02840-6
    收录情况:SCIE、EI
  • Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology

    2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019,,2019-08.
    Yu, Tian (1); Chen, Cheng (2); Jiang, Feng (3); Chen, Li (1); Zhang, Mingchuan (3); Yu, Daquan (1)
    EI:20202108698642   10.1109/ICEPT47577.2019.245132
    收录情况:EI
  • Development of Laser-Induced Deep Etching Process for Through Glass Via

    2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019,,2019-08.
    Chen, Li (1); Wu, Heng (2); Zhang, Mingchuan (2); Jiang, Feng (2); Yu, Tian (1); Yu, Daquan (1)
    EI:20202108698885   10.1109/ICEPT47577.2019.245208
    收录情况:EI
  • 玻璃通孔三维互连镀铜填充技术发展现状

    电化学,1006-3471,2022-07-05.
    纪执敬;凌惠琴;吴培林;余瑞益;于大全;李明
    CSCD扩展
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    机械工程学报,0577-6686,2022-01-20.
    赵瑾;李威;钟毅;于大全;秦飞
    CSCD核心
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    电子与封装,1681-1070,2025-02-11.
    吴艺雄;杜韵辉;陶泽明;钟毅;于大全
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    电子与封装,1681-1070,2024-06-20.
    王成迁;汤文学;戴飞虎;丁荣峥;于大全
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    电子与封装,1681-1070,2024-06-20.
    赵瑾;于大全;秦飞
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    电子与封装,1681-1070,2024-06-20.
    黎科;张鑫硕;夏启飞;钟毅;于大全
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    电子与封装,1681-1070,2023-03-20.
    钟毅;江小帆;喻甜;李威;于大全
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    电子与封装,1681-1070,2021-04-20.
    陈力;杨晓锋;于大全
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    中国集成电路,1681-5289,2021-03-05.
    陈作桓;于大全;张名川