Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application

Optical Amplification at 1.5 μm in Er<SUP>III</SUP> Coordination Polymer-Doped Waveguides Based on Intramolecular Energy Transfer

Demonstration of Optical Gain at 1535 nm Based on Er<SUP>III</SUP> Complex-Doped Polymer Waveguides Under Light-Emitting Diode Excitation

Terahertz sensing with a 3D meta-absorbing chip based on two-photon polymerization printing

Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces

Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells

Influence of growth parameters and systematical analysis on 8-inch piezoelectric AlN thin films by magnetron sputtering

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Development of CGA-PWW Devices Based on Advanced Wafer-Level Processing Technology

Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection

Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging

Metal Penetration and Grain Boundary in MoS₂ Memristors

Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging

Quasi-2D Phonon Transport in Diamond Nanosheet

Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis

Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces

Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers

Development of high performance 2.5D packaging using glass interposer with through glass vias

Influence of Growth Parameters and Systematical Analysis on 8-Inch Piezoelectric Aln Thin Films by Magnetron Sputtering

Large-area multilayer molybdenum disulfide for 2D memristors

Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

On the optimization of molding warpage for wafer-level glass interposer packaging

Electrical performance characterization of glass substrate for millimeter-wave applications

High-Gain of Nd<SUP>III</SUP> Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 μm Wavelengths Based on Intramolecular Energy Transfer Mechanism

A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology

Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging

Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration

A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band

A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

A Novel Air-Filled Post-Wall Waveguide based on the Column Grid Array Packaging

Electrical properties of AlGaN/GaN HEMT under different temperatures

Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating

Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration

Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer-Level Packaging

On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

TGV filling process based on low temperature conductive silver paste

Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Development of a Reliable High-Performance WLP for a SAW Device

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Stress Issues in 3D Interconnect Technology Using Through Glass Vias

Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters

Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate

Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion

Enhancement of inductance and quality factor of solenoid inductor by Integrating Printing magnetic film On glass wafer

Reliability Study of WLP for IPD with Through Glass Vias Vertical Interconnection

Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films

Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology

Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology

Double-sided Electroplating Process for through Glass Vias (TGVs) Filling

Warpage Characteristic of Glass Interposer with Different CTE's and Thickness

The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

Low Temperature Bonding Polycrystalline Diamond to Si by Using Au Thin-layer for High-power Semiconductor Devices

Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package

Characteristics of 10-110GHz Transmission Lines on Fused Silica Substrate for Millimeter-wave Modules

3D Wafer Level Packaging for SAW Filter Using Thin Glass Capping with through Glass Vias

Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping

Selective metallization of glass with improved adhesive layer and optional hydrophobic surface

A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm(2) Power Density

Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

Development of three-dimensional wafer level chip scale packaging using via last TSV and UV laser releasable temporary bonding technologies

The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays

Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

Synergistic Effect of Additives on Filling of Tapered TGV Vias by Copper Electroplating

A promising embedded silicon fan-out wafer level package with laser releasable temporary bonding technology

Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Process, Design and Simulation for Millimeter Wave Chip Packaging Using Embedded Glass Fan-Out Technology

Development of Laser-Induced Deep Etching Process for Through Glass Via