学者信息
已发表成果：
WOK 论文 92 篇;中文核心 39 篇;其它论文 28 篇;专利发明 8 个;
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Effects of 5, 5-Dimethylhydantoin on Electroless Copper Plating
Gaodeng Xuexiao Huaxue Xuebao/Chemical Journal of Chinese Universities,0251-0790,2022-08-10.
Zheng Anni; Jin Lei; Yang Jiaqiang; Wang Zhaoyun; Li Weiqing; Yang Fangzu; Zhan Dongping; Tian Zhon...
WOS:000856799200008 EI:20223912794712 10.7503/cjcu20220191
收录情况：SCIE、EI -
Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents
CHEMELECTROCHEM,2196-0216,2022-06-14.
Li, Wei-Qing; Jin, Lei; Yang, Jia-Qiang; Wang, Zhao-Yun; Zhan, Dongping; Yang, Fang-Zu; Tian, Zhong...
WOS:000807119300001 EI:20222512253205 10.1002/celc.202200423
收录情况：SCIE、EI -
Advances in Pretreatments for Electroless Copper Plating on Polymer Materials
ACTA CHIMICA SINICA,0567-7351,2022-05-15.
Zheng, Annia; Jin, Lei; Yang, Jiaqiang; Li, Weiqing; Wang, Zhaoyun; Yang, Fangzu; Zhan, Dongping; T...
WOS:000804113700011 10.6023/A22010026
收录情况：SCIE -
<p>Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications<br></p>
Electrochimica Acta,0013-4686,2022-04-01.
Wang, Zhao-Yun; Jin, Lei; Li, Guang; Yang, Jia-Qiang; Li, Wei-Qing; Zhan, DongPing; Jiang, Yan-Xia;...
WOS:000778862300001 EI:20220811678020 10.1016/j.electacta.2022.140018
收录情况：SCIE、EI -
Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**
CHEMELECTROCHEM,2196-0216,2022-01.
Tan, Zhuo; Liu, Shuai; Wu, Jiedu; Nan, Ziang; Yang, Fangzu; Zhan, Dongping; Yan, Jiawei; Mao, Bingw...
WOS:000744676100001 EI:20220411503016 10.1002/celc.202101412
收录情况：SCIE、EI -
Novel, Simple, and Green Citrate-Based Copper Electronic Electroplating Bath in Microvia Void-Free Filling for Printed Circuit Board Application
ACS Sustainable Chemistry and Engineering,2168-0485,2022.
Jin, Lei; Li, Wei-Qing; Wang, Zhao-Yun; Yang, Jia-Qiang; Zheng, An-Ni; Yang, Fang-Zu; Zhan, Dongpin...
WOS:000877328600001 EI:20224413027679 10.1021/acssuschemeng.2c03960
收录情况：SCIE、EI
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5,5-二甲基乙内酰脲在化学镀铜中的作用
高等学校化学学报,0251-0790,2022-08-10.
郑安妮;金磊;杨家强;王赵云;李威青;杨防祖;詹东平;田中群
CSCD核心 -
聚合物材料表面化学镀铜的前处理研究进展
化学学报,0567-7351,2022-05-15.
郑安妮;金磊;杨家强;李威青;王赵云;杨防祖;詹东平;田中群
CSCD核心 -
亚硫酸盐无氰电沉积金新工艺及机制(英文)
电化学,1006-3471,2022-03-20.
杨家强;金磊;李威青;王赵云;杨防祖;詹东平;田中群
CSCD扩展 -
亚硫酸盐无氰电沉积金新工艺及机制（英文）
电化学,1006-3471,2022-03-20.
杨家强;金磊;李威青;王赵云;杨防祖;詹东平;田中群
CSCD扩展
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系统级封装深盲孔化学镀铜的研究
印制电路信息,1009-0096,2022-08-31.
杨彦章;张坚诚;刘彬云;詹东平;杨防祖