学者信息
已发表成果：
WOK 论文 79 篇;中文核心 2 篇;其它论文 8 篇;
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Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
MICROMACHINES,,2022-10.
Zhao, Jin; Chen, Zuohuan; Qin, Fei; Yu, Daquan
WOS:000873274700001 EI:20224413036256 10.3390/mi13101799
收录情况：SCIE、EI -
Development of a Reliable High-Performance WLP for a SAW Device
SENSORS,,2022-08.
Chen, Zuohuan; Yu, Daquan
WOS:000839746500001 10.3390/s22155760
收录情况：SCIE -
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
SENSORS,,2022-03.
Chen, Zuohuan; Yu, Daquan; Zhong, Yi
WOS:000774299800001 10.3390/s22062114
收录情况：SCIE -
Stress Issues in 3D Interconnect Technology Using Through Glass Vias
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,0577-6686,2022-01-20.
Zhao, Jin (1); Li, Wei (2); Zhong, Yi (2); Yu, Daquan (2); Qin, Fei (1)
EI:20221611993409 10.3901/JME.2022.02.246
收录情况：EI -
Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters
IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2022.
Li, Wei; Yu, Daquan
WOS:000800180000021 EI:20221611993986 10.1109/TCPMT.2022.3165638
收录情况：SCIE、EI -
Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias
IEEE Electron Device Letters,0741-3106,2022.
Su, Yangquan; Yu, Daquan; Ruan, Wenbiao; Jia, Ning
WOS:000800191500029 EI:20221712037991 10.1109/LED.2022.3168877
收录情况：SCIE、EI -
Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate
2022 China Semiconductor Technology International Conference, CSTIC 2022,,2022.
Ma, Haozhe (1, 2); Hu, Zhihui (1, 2); Zhou, Qing (1, 2); Chen, Jiabin (1); Yu, Daquan (1, 2)
EI:20223712740216 10.1109/CSTIC55103.2022.9856753
收录情况：EI -
Warpage Investigation of Fan-Out Wafer-Level Packaging With Novel Thermosetting Films
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
Li, Wei (1); Yu, Daquan (1, 2)
EI:20224012840451 10.1109/ICEPT56209.2022.9873208
收录情况：EI -
Low - Temperature Die to Glass Wafer Bonding Based on Au-Au Atomic Diffusion
2022 China Semiconductor Technology International Conference, CSTIC 2022,,2022.
Bao, Shuchao (1, 2); Zhang, Yi (1, 2); He, Yimin (2, 3); Li, Ke (1, 2); Yu, Daquan (1, 2)
EI:20223712739976 10.1109/CSTIC55103.2022.9856914
收录情况：EI -
Enhancement of inductance and quality factor of solenoid inductor by Integrating Printing magnetic film On glass wafer
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
Hu, Zhihui (1); Ma, Haozhe (1); Zhou, Qing (1); Bao, Shuchao (1); Yu, Daquan (2)
EI:20224012840723 10.1109/ICEPT56209.2022.9873440
收录情况：EI -
Reliability Study of WLP for IPD with Through Glass Vias Vertical Interconnection
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
Zhao, Jin (1, 2); Qin, Fei (1); Yu, Daquan (3); Chen, Zuohuan (2)
EI:20224012840877 10.1109/ICEPT56209.2022.9873383
收录情况：EI -
Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,,2022.
Chen, Zuohuan (1); Zhao, Jin (2); Zhang, Jiqin (3); Zhang, Long (3); Yu, Daquan (1)
EI:20224012840450 10.1109/ICEPT56209.2022.9873207
收录情况：EI -
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2022.
Chen, Zuohuan; Yu, Daquan; Jiang, Feng
WOS:000761210100023 EI:20220311480736 10.1109/TCPMT.2022.3140863
收录情况：SCIE、EI
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玻璃通孔三维互连镀铜填充技术发展现状
电化学,1006-3471,2022-07-05.
纪执敬;凌惠琴;吴培林;余瑞益;于大全;李明
CSCD扩展 -
玻璃通孔三维互连技术中的应力问题
机械工程学报,0577-6686,2022-01-20.
赵瑾;李威;钟毅;于大全;秦飞
CSCD核心