厦门大学学者库

学者信息

杨防祖 (FangZu Yang)

化学化工学院

ResearcherID:G-4651-2010

按发表年份分组
2024
2023
2022
2021
2020
按发表刊物分组
合作者

已发表成果：

WOK 论文 92 篇;中文核心 39 篇;其它论文 28 篇;专利发明 8 个;

  • Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization

    Journal of Colloid and Interface Science,0021-9797,2023-10-15.
    Zheng, An-Ni; Wang, Zhao-Yun; Yang, Jia-Qiang; Jin, Lei; Yang, Fang-Zu; Zhan, Dong-Ping
    WOS:001054121500001   EI:20232414210218   10.1016/j.jcis.2023.05.177
    收录情况：SCIE、EI

  • 1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating

    Journal of Industrial and Engineering Chemistry,1226-086X,2023-09-25.
    Jin, Lei; Wang, Zhao-Yun; Cai, Zhuan-Yun; Yang, Jia-Qiang; Zheng, An-Ni; Yang, Fang-Zu; Wu, De-Yin;...
    WOS:001024487900001   EI:20232514272882   10.1016/j.jiec.2023.05.036
    收录情况：SCIE、EI

  • Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection

    Colloids and Surfaces A: Physicochemical and Engineering Aspects,0927-7757,2023-08-20.
    Jin, Lei; Zheng, An-Ni; Wang, Mei; Yang, Jia-Qiang; Wang, Zhao-Yun; Yang, Fang-Zu; Wu, De -Yin; Zha...
    WOS:001015488700001   EI:20232114140733   10.1016/j.colsurfa.2023.131706
    收录情况：SCIE、EI

  • Confined Etchant Layer Technique: An Electrochemical Approach to Micro-/Nanomachining

    JOURNAL OF PHYSICAL CHEMISTRY C,1932-7447,2023-07-06.
    Han, Lianhuan; Xu, Hantao; Shi, Kang; Zhou, Jian-Zhang; Yang, Fang-Zu; Zhan, Dongping; Tian, Zhong-...
    WOS:001022346900001   EI:20232914412374   10.1021/acs.jpcc.3c02985
    收录情况：SCIE、EI

  • A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening

    Journal of Electroanalytical Chemistry,1572-6657,2023-05-01.
    Wang, Zhao-Yun; Jin, Lei; Yang, Jia-Qiang; Li, Wei-Qing; Wu, De-Yin; Zhan, DongPing; Yang, Fang-Zu;...
    WOS:000964947300001   EI:20231413855107   10.1016/j.jelechem.2023.117373
    收录情况：SCIE、EI

  • Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)(4)(-) coordination ions

    Electrochimica Acta,0013-4686,2023-01-01.
    Jin, Lei; Liang, Zhi-Hao; Yang, Jia-Qiang; Zheng, An-Ni; Wang, Zhao-Yun; Yang, Fang-Zu; Wu, De-Yin;...
    WOS:000911127800001   EI:20224513072477   10.1016/j.electacta.2022.141494
    收录情况：SCIE、EI

  • TSV电镀铜添加剂及作用机理研究进展

    中国科学:化学,1674-7224,2023-10-09.
    马盛林;王燕;陈路明;杨防祖;王岩;王其强;肖雄
    CSCD核心库

  • 面向集成电路产业的电子电镀研究方法

    中国科学:化学,1674-7224,2023-08-16.
    金磊;杨家强;赵弈;王赵云;陈思余;郑安妮;宋韬;杨防祖;詹东平
    CSCD核心库