学者信息
已发表成果：
WOK 论文 79 篇;中文核心 2 篇;其它论文 8 篇;
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Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis
APPLIED PHYSICS LETTERS,0003-6951,2023-11-20.
Li, Bo; Ye, Tian; Yan, Han; Zhu, Yunting; Bao, Lingjie; Li, Mingpo; Cheng, Qijin; Zhuang, Pingping;...
WOS:001106651900005 EI:20234815131887 10.1063/5.0175474
收录情况：SCIE、EI -
Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces
SSRN,1556-5068,2023-11-16.
Zhou, Shangtong (1); Jiang, Xiaofan (1); Zhong, Yi (1); Yu, Daquan (1); Cheng, Qijin (1)
EI:20230416661 10.2139/ssrn.4635143
收录情况：EI -
Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers
SSRN,1556-5068,2023-11-08.
Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
EI:20230403026 10.2139/ssrn.4627642
收录情况：EI -
Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers
SSRN,1556-5068,2023-10-06.
Jiang, Xiaofan (1); Tao, Zeming (1); Li, Yuan (2); Sun, Fangyuan (2); Yu, Daquan (1); Zhong, Yi (1)
EI:20230355768 10.2139/ssrn.4593961
收录情况：EI -
Development of high performance 2.5D packaging using glass interposer with through glass vias
Journal of Materials Science: Materials in Electronics,0957-4522,2023-09.
Zhao, Jin; Chen, Zuohuan; Qin, Fei; Yu, Daquan
WOS:001064918900004 EI:20233714717337 10.1007/s10854-023-11185-0
收录情况：SCIE、EI -
Influence of Growth Parameters and Systematical Analysis on 8-Inch Piezoelectric Aln Thin Films by Magnetron Sputtering
SSRN,1556-5068,2023-08-21.
Wu, Shaocheng (1); Xu, Rongbin (1); Guo, Bingliang (2); Ma, Yinggong (2); Yu, Daquan (1)
EI:20230284988 10.2139/ssrn.4546667
收录情况：EI -
Large-area multilayer molybdenum disulfide for 2D memristors
Materials Today Nano,2588-8420,2023-08.
Zhuang, Pingping; Yan, Han; Li, Bo; Dou, Chao; Ye, Tian; Zhou, Changjie; Zhu, Huili; Tian, Bo; Chen...
WOS:001049935800001 EI:20232214170221 10.1016/j.mtnano.2023.100353
收录情况：SCIE、EI -
Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD
Journal of Materials Research and Technology,2238-7854,2023-05-01.
Wang, Chengqian; Luo, Keyu; He, Peng; Zhou, Hongzhi; Li, Rongqing; Zhang, Zhihao; Yu, Daquan; Zhang...
WOS:000964618700001 EI:20231413844478 10.1016/j.jmrt.2023.03.102
收录情况：SCIE、EI -
Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP
ELECTRONICS,,2023-04-30.
Li, Wei; Yu, Daquan
WOS:000987311700001 10.3390/electronics12092073
收录情况：SCIE -
On the optimization of molding warpage for wafer-level glass interposer packaging
Journal of Materials Science: Materials in Electronics,0957-4522,2023-04.
Bao, Shuchao; Li, Wei; He, Yimin; Zhong, Yi; Zhang, Long; Yu, Daquan
WOS:000980451400003 EI:20231914058008 10.1007/s10854-023-10475-x
收录情况：SCIE、EI -
Electrical performance characterization of glass substrate for millimeter-wave applications
Journal of Materials Science: Materials in Electronics,0957-4522,2023-01.
Yu, Tian; Yu, Daquan
WOS:000913653300002 EI:20230313400320 10.1007/s10854-022-09583-x
收录情况：SCIE、EI -
High-Gain of Nd<SUP>III</SUP> Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 μm Wavelengths Based on Intramolecular Energy Transfer Mechanism
Advanced Materials,0935-9648,2023.
Lin, Zhuliang; Man, Yi; Lv, Ziyue; Zhang, Baoping; Xu, Hui; Yu, Daquan; Yang, Xingchen; He, Yan; Sh...
WOS:000928593000001 EI:20230613564241 10.1002/adma.202209239
收录情况：SCIE、EI -
A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology
IEEE Electron Device Letters,0741-3106,2023.
Ma, Haozhe; Hu, Zhihui; Yu, Daquan
WOS:001021302800047 EI:20232114132452 10.1109/LED.2023.3275197
收录情况：SCIE、EI -
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
IEEE Electron Device Letters,0741-3106,2023.
Hu, Zhihui; Zhou, Qing; Ma, Haozhe; Wang, Manyu; Zhong, Yi; Dou, Yuhang; Yu, Daquan
WOS:001108431800037 EI:20232914408110 10.1109/LED.2023.3295596
收录情况：SCIE、EI -
Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration
IEEE Electron Device Letters,0741-3106,2023.
Cai, Jing; Zhou, Qing; Zhang, Miao; Wu, Shu Yue; Yu, Daquan; Liu, Qing Huo
WOS:001091151300016 EI:20233814765888 10.1109/LED.2023.3314408
收录情况：SCIE、EI -
A Novel Low-Cost and Low-Loss DS-GWG Solution using Advanced Glass Packages at V-Band
2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings,,2023.
Cai, Jing (1); Zhang, Miao (1); Yu, Da Quan (1); Liu, Qing Huo (2)
EI:20233814749784 10.1109/IWS58240.2023.10222257
收录情况：EI -
Electrical properties of AlGaN/GaN HEMT under different temperatures
Proceedings of SPIE - The International Society for Optical Engineering,0277-786X,2023.
Liang, Yihang (1); Yu, Tian (1); Yu, Daquan (1)
EI:20234815108265 10.1117/12.3010802
收录情况：EI -
A Low-Cost On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology,2156-3950,2023.
Yu, Tian; Li, Weiwen; Yu, Daquan
WOS:001098139000019 EI:20234014841758 10.1109/TCPMT.2023.3318232
收录情况：SCIE、EI -
A Novel Air-Filled Post-Wall Waveguide based on the Column Grid Array Packaging
2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings,,2023.
Wu, Shuyue (1); Zhou, Qing (1); Zhang, Miao (1); Yu, Da Quan (1); Huo Liu, Qing (2)
EI:20234515020966 10.1109/ICMMT58241.2023.10277428
收录情况：EI -
Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Wang, Manyu; Li, Ke; Bao, Shuchao; Liu, Zhongliang; Zhu, Yunting; Wang, Jiahui; Xia, Qifei; Wu, Sha...
WOS:001221819200137 EI:20241816014880 10.1109/ICEPT59018.2023.10492061
收录情况：EI、CPCI-S -
Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Jiang, Xiaofan; Tao, Zeming; Yu, Tian; Jiang, Binbin; Zhong, Yi; Yu, Daquan
WOS:001221819200122 EI:20241816014865 10.1109/ICEPT59018.2023.10492042
收录情况：EI、CPCI-S -
Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer-Level Packaging
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Jing, Cai; Wu, Shuyue; Zhang, Miao; Yu, Daquan
WOS:001221819200268 EI:20241816014511 10.1109/ICEPT59018.2023.10492214
收录情况：EI、CPCI-S -
On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Yu, Tian; Chen, Xin; Zhou, Yaqing; Liu, Zhongliang; Hu, Yuwen; Yu, Daquan
WOS:001221819200100 EI:20241816014593 10.1109/ICEPT59018.2023.10492015
收录情况：EI、CPCI-S -
TGV filling process based on low temperature conductive silver paste
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Yu, Chen; Li, Wei; Yang, Tingting; Wu, Heng; Yu, Daquan
WOS:001221819200235 EI:20241816014628 10.1109/ICEPT59018.2023.10492174
收录情况：EI、CPCI-S -
Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2836-9734,2023.
Zhao, Jin; Qin, Fei; Chen, Zuohuan; Yu, Daquan
WOS:001221819200383 EI:20241816014676 10.1109/ICEPT59018.2023.10492334
收录情况：EI、CPCI-S
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芯片三维互连技术及异质集成研究进展
电子与封装,1681-1070,2023-03-20.
钟毅;江小帆;喻甜;李威;于大全
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“先进三维封装与异质集成”专题前言
电子与封装,1681-1070,2023-03-20.
于大全