学者信息
已发表成果：
WOK 论文 92 篇;中文核心 39 篇;其它论文 28 篇;专利发明 8 个;
-
1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening
Colloids and Surfaces A: Physicochemical and Engineering Aspects,0927-7757,2024-08-20.
Zhao, Yi; Wang, Zhao-Yun; Jin, Lei; Yang, Jia-Qiang; Song, Tao; Yang, Fang-Zu; Zhan, Dongping
WOS:001241394400001 EI:20242016094098 10.1016/j.colsurfa.2024.134239
收录情况：SCIE、EI -
Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating
CHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE,0251-0790,2024-08-10.
Jin, Lei; Wang, Zhaoyun; Yang, Fangzu; Zhan, Dongping
WOS:001295496700004 EI:20243416911505 10.7503/cjcu20240146
收录情况：SCIE、EI -
Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
Journal of Manufacturing Processes,1526-6125,2024-07-15.
Wang, Zhao-Yun; Yu, Daquan; Jin, Lei; Yang, Jia-Qiang; Zhan, Dongping; Zu Yang, Fang-; Sun, Shi-Gang
WOS:001247344100001 EI:20242216161061 10.1016/j.jmapro.2024.05.041
收录情况：SCIE、EI -
Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
Journal of Electroanalytical Chemistry,1572-6657,2024-07-01.
Song, Tao; Wang, Zhao-Yun; Yang, Jia-Qiang; Zhao, Yi; Yang, Fang-Zu; Zhan, Dongping
WOS:001242623800001 EI:20242016094546 10.1016/j.jelechem.2024.118340
收录情况：SCIE、EI -
Phase transformation sequence of amorphous nickel-molybdenum electrodeposit
Materials Today Communications,,2024-06.
Jin, Lei; Guo, Jia-Yao; Cui, Miao-Miao; Yang, Fang-Zu; Zhan, Dongping
WOS:001227021800001 EI:20241515891904 10.1016/j.mtcomm.2024.108863
收录情况：SCIE、EI -
Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling
SURFACES AND INTERFACES,2468-0230,2024-01.
Yang, Jia-Qiang; Qiu, Jiang-Peng; Jin, Lei; Wang, Zhao-Yun; Song, Tao; Zhao, Yi; Yang, Xiao-Hui; Ch...
WOS:001139132600001 10.1016/j.surfin.2023.103679
收录情况：SCIE
-
协同添加剂对电子电镀铜成核及镀层形貌与结构的影响机制
高等学校化学学报,0251-0790,2024-08-10.
金磊;王赵云;杨防祖;詹东平
CSCD核心库