Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers

Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application

Optical Amplification at 1.5 μm in Er<SUP>III</SUP> Coordination Polymer-Doped Waveguides Based on Intramolecular Energy Transfer

Demonstration of Optical Gain at 1535 nm Based on Er<SUP>III</SUP> Complex-Doped Polymer Waveguides Under Light-Emitting Diode Excitation

Terahertz sensing with a 3D meta-absorbing chip based on two-photon polymerization printing

Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces

Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers

Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells

Influence of growth parameters and systematical analysis on 8-inch piezoelectric AlN thin films by magnetron sputtering

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Development of CGA-PWW Devices Based on Advanced Wafer-Level Processing Technology

Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection

Quasi-2D Phonon Transport in Diamond Nanosheet

Warpage Prediction and Optimization for Wafer-Level Glass Interposer Packaging

Metal Penetration and Grain Boundary in MoS₂ Memristors

Development of Low-Loss and Low-Cost Air-Filled Transmission Lines based on Advanced Glass Wafer Packaging